MC9S08AC60CFDE vs MC9S08AW60MFDE Comparaison
Comparaison détaillée côte à côte de MC9S08AC60CFDE par NXP Semiconductors et MC9S08AW60MFDE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08AC60CFDE | MC9S08AW60MFDE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $8,60 | $4,46 |
| Core Processor | S08 (HCS08), 8-bit CISC | — |
| Core Size | 8-bit | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Tension d'alimentation de fonctionnement | 3.3 V / 5 V | — |
| Number of I/O | 38 | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | Up to 16-channel with automatic compare function | — |
| Communication Interfaces | 2x SCI (LIN 2.0, SAE J2602), SPI, IIC | — |
| Peripherals | ADC, SCI, SPI, IIC | — |
| Boîtier | 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad | 48-pin QFN-EP (7x7 mm, MO-220VKKD-2, 0.5 mm pitch) |
| Type de montage | Surface Mount | Surface Mount |
| Family Compatibility | Pin-, peripheral- and tool-compatible with MCF51AC256/128 (Flexis) | — |
| Statut du cycle de vie | NRND (per NXP product page) | — |
| Statut RoHS | ROHS COMPLIANT (per distributor datasheet listing) | Compliant |
| Packaging | Tray | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Core Architecture | — | HCS08 (8-bit CISC, enhanced HC08) |
| CPU Speed | — | 40 MHz (20 MHz internal bus) |
| Program Memory | — | 60 KB Flash |
| RAM | — | 2 KB |
| Tension d'alimentation | — | 2.7 V to 5.5 V |
| I/O Ports | — | 38 |
| Température de fonctionnement | — | -40C to +85C (industrial) |
| ROM Type | — | Flash (in-application programmable) |
| Debug Interface | — | Single-wire BDM (background debug mode) |
| ADC | — | Up to 16-channel 10-bit |
| Timers | — | Multiple 16-bit timer/PWM channels |
| Communication | — | SCI (UART), SPI, I2C |