MC9S08AW16CPUE vs MC9S08AW60CPUE Comparación
Comparación detallada lado a lado de MC9S08AW16CPUE por NXP Semiconductors y MC9S08AW60CPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AW16CPUE | MC9S08AW60CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,20 | $0,00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Core Architecture | CISC | — |
| Frecuencia de reloj máxima | 40 MHz (CPU) / 20 MHz (bus) | — |
| Program Memory Size | 16KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 1K x 8 | 4 KB |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Temperatura de funcionamiento | -40C to +85C | [DATA_NEEDED: Operating Temperature Range] |
| ADC Resolution | 10-bit | — |
| ADC Channels | 16 | — |
| I/O Ports | 38 | — |
| Oscillator Type | Internal | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Encapsulado | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Instruction Set | HC08 with added BGND instruction | HC08 (CISC) with added BGND instruction |
| Speed (CPU Clock) | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| I/O Count | — | 38 |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | — | 10-bit |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |
| Family | — | HCS08 (S08AW) |