MC9S08AW60MPUE557 vs MC9S08AW16MPUE Comparación
Comparación detallada lado a lado de MC9S08AW60MPUE557 por NXP Semiconductors y MC9S08AW16MPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
MC9S08AW60MPUE557 ✓ ActivoNXP Semiconductors
MC9S08AW16MPUE - 8-bit HCS08 MCU, 16KB Flash, 64-LQFP | NXP
MC9S08AW16MPUE ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08AW60MPUE557 | MC9S08AW16MPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,10 | $4,35 |
| Core Architecture | HCS08 (enhanced S08) | — |
| Ancho del bus de datos | 8-bit | 8 bit |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| Tensión de alimentación de funcionamiento | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Pins | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa | — |
| Encapsulado | 64-LQFP (10x10 mm) | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| ADC | [DATA_NEEDED: number of channels and resolution] | — |
| PWM Channels | [DATA_NEEDED: PWM channel count] | — |
| Serial Interfaces | SCI, SPI, I2C (per NXP family description) | — |
| Debug Interface | Single-wire Background Debug Mode (BDM) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Core | — | HCS08 (enhanced S08) |
| Program Memory Size | — | 16 KB Flash |
| RAM Size | — | 1 KB |
| Frecuencia de reloj máxima | — | 40 MHz |
| ADC Resolution | — | 10 bit |
| Number of I/Os | — | 54 I/O |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +125 C (Automotive Grade 1) |
| Estilo de montaje | — | SMD/SMT |
| Encapsulado / Carcasa | — | 64-LQFP (10x10 mm, gull-wing) |
| Package Code (per JEDEC) | — | LFQFP |
| Series | — | MC9S08AW16 (S08AW family) |
| Communication Interfaces | — | SCI, SPI, I2C |
| Timers | — | TPM, MTIM, RTI |
| Watchdog | — | Yes (COP) |
| Low Voltage Detect (LVD) | — | Yes |