MC9S08DN32ACLC vs MC9S08GT16CFBE Comparación
Comparación detallada lado a lado de MC9S08DN32ACLC por NXP Semiconductors y MC9S08GT16CFBE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC Obsolete
Comparación de especificaciones
| Parámetro | MC9S08DN32ACLC | MC9S08GT16CFBE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,35 | $4,65 |
| Series | S08DN | — |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-Bit |
| CPU Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 32 KB (32K x 8) | — |
| Program Memory Type | FLASH | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| RAM Size | 2 KB | — |
| Number of I/O | 25 | 36 |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
| Number of Interrupt Sources | Up to 32 | — |
| Instruction Set | HC08 with added BGND | — |
| Tensión de alimentación | 2.7 V to 5.5 V | 2.5 V / 3.3 V |
| Encapsulado | 32-LQFP (7x7 mm) | 44-QFP (10x10 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C | [DATA_NEEDED: operating temperature range] |
| Part Status | Obsolete | — |
| Maximum Bus Frequency | — | 40 MHz |
| Flash Memory | — | 16 KB (16K x 8) |
| RAM | — | 2 KB |
| EEPROM | — | None (Flash-based) |
| ADC Resolution | — | 10-bit (8 channels) |
| Communication Interfaces | — | I2C, SCI, SPI |
| Packaging | — | Tray |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |