MC9S08DN32CLC vs MC9S08DZ32AMLH Comparación
Comparación detallada lado a lado de MC9S08DN32CLC por NXP Semiconductors y MC9S08DZ32AMLH por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DN32CLC | MC9S08DZ32AMLH |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,25 | $0,00 |
| Core Processor | S08 (HCS08) | HCS08 (S08 core) |
| Core Size | 8-Bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Program Memory Size | 32 KB (32K x 8) FLASH | 32KB (32K x 8) FLASH |
| RAM Size | 1 KB | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| Number of I/O | 25 | — |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Encapsulado | 32-LQFP (7x7 mm) | 64-LQFP (10x10 mm) |
| Terminal Form | GULL WING | — |
| No. of Terminals | 32 | — |
| Package Shape | SQUARE | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Grade | INDUSTRIAL | — |
| Part Status | Obsolete | — |
| Instruction Set | — | HC08 with added BGND instruction (CISC) |
| Maximum CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Tensión de alimentación | — | 3.3V / 5V |
| ADC Resolution | — | 12 bit |
| ADC Channels | — | 24-channel |
| ADC Conversion Time | — | 2.5 us |
| CAN Module | — | Yes (embedded CAN, MSCAN) |
| EEPROM | — | Embedded EEPROM |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug Interface | — | On-chip emulation/debug (background debug, BGND) |
| Packaging | — | Tray |
| Series | — | S08DZ (S08 Family, S08D Series) |
| Product Category | — | Microcontrollers (MCU) |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |