MC9S08DN32CLC vs MC9S08DZ32AMLH Comparaison
Comparaison détaillée côte à côte de MC9S08DN32CLC par NXP Semiconductors et MC9S08DZ32AMLH par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DN32CLC | MC9S08DZ32AMLH |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4,25 | $0,00 |
| Core Processor | S08 (HCS08) | HCS08 (S08 core) |
| Core Size | 8-Bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Program Memory Size | 32 KB (32K x 8) FLASH | 32KB (32K x 8) FLASH |
| RAM Size | 1 KB | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| Number of I/O | 25 | — |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Boîtier | 32-LQFP (7x7 mm) | 64-LQFP (10x10 mm) |
| Terminal Form | GULL WING | — |
| No. of Terminals | 32 | — |
| Package Shape | SQUARE | — |
| Type de montage | Surface Mount | Surface Mount |
| Temperature Grade | INDUSTRIAL | — |
| Part Status | Obsolete | — |
| Instruction Set | — | HC08 with added BGND instruction (CISC) |
| Maximum CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Tension d'alimentation | — | 3.3V / 5V |
| ADC Resolution | — | 12 bit |
| ADC Channels | — | 24-channel |
| ADC Conversion Time | — | 2.5 us |
| CAN Module | — | Yes (embedded CAN, MSCAN) |
| EEPROM | — | Embedded EEPROM |
| Interrupt/Reset Sources | — | Up to 32 |
| Debug Interface | — | On-chip emulation/debug (background debug, BGND) |
| Packaging | — | Tray |
| Series | — | S08DZ (S08 Family, S08D Series) |
| Product Category | — | Microcontrollers (MCU) |
| Statut du cycle de vie | — | NRND (Not Recommended for New Designs) |