MC9S08DV16AMLF vs MC9S08DV60AMLF Comparación
Comparación detallada lado a lado de MC9S08DV16AMLF por NXP Semiconductors y MC9S08DV60AMLF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP
MC9S08DV60AMLF ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08DV16AMLF | MC9S08DV60AMLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,17 | $4,60 |
| Product Type | 8-bit S08 automotive microcontroller | — |
| CPU Core | S08 core with HC08 instruction set and BGND instruction | — |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory | 16 KB Flash (16K x 8) | — |
| RAM | 1 KB (1K x 8) | — |
| I/O Pins | 39 | — |
| ADC | 16 channels, 12-bit resolution, 2.5 s conversion-time figure | 8-channel 10-bit (per datasheet family) |
| Interrupt and Reset Sources | Up to 32 sources | — |
| Oscillator Type | External | — |
| Communication Features | CAN and LIN connectivity | — |
| Encapsulado | 48-LQFP, 7 mm x 7 mm | 48-LQFP (7x7 mm) |
| Tipo de montaje | Surface mount | Surface Mount |
| Temperature Grade | Automotive | — |
| Packaging | Tray | — |
| Program Memory Type | Flash | — |
| Terminal Count | 48 | — |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale) |
| Series | — | S08 |
| Core Processor | — | HCS08 (enhanced HC08 with BGND) |
| Core Size | — | 8-bit |
| Core Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) Flash |
| RAM Size | — | 3 KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Number of I/O | — | 53 GPIO + 1 input-only |
| Communication Interfaces | — | MSCAN (CAN 2.0A/B), SCI/SPI, LIN master |
| Timers | — | Multiple TPM (per datasheet family) |
| Temperatura de funcionamiento | — | -40C to +125C |
| Estado RoHS | — | ROHS3 Compliant |
| Debug Interface | — | Single-wire BDM |