MC9S08DV60AMLF vs MC9S08DV16AMLF Comparación

Comparación detallada lado a lado de MC9S08DV60AMLF por NXP Semiconductors y MC9S08DV16AMLF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC9S08DV60AMLF MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP

MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP

MC9S08DV60AMLF ✓ Activo
NXP Semiconductors
MC9S08DV16AMLF MC9S08DV16AMLF - 40MHz 16KB Flash CAN MCU | NXP | Automotive

MC9S08DV16AMLF - 40MHz 16KB Flash CAN MCU | NXP | Automotive

MC9S08DV16AMLF Nrnd

Comparación de especificaciones

Parámetro MC9S08DV60AMLF MC9S08DV16AMLF
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Activo NRND
Estado del stock In Stock In Stock
Precio unitario (USD) $4,60 $9,17
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Series S08 —
Core Processor HCS08 (enhanced HC08 with BGND) —
Core Size 8-bit —
Core Speed 40 MHz (20 MHz bus) —
Program Memory Size 60 KB (60K x 8) Flash —
RAM Size 3 KB —
Supply Voltage Range 2.7 V to 5.5 V —
Number of I/O 53 GPIO + 1 input-only —
Communication Interfaces MSCAN (CAN 2.0A/B), SCI/SPI, LIN master —
ADC 8-channel 10-bit (per datasheet family) 16 channels, 12-bit resolution, 2.5 s conversion-time figure
Timers Multiple TPM (per datasheet family) —
Encapsulado 48-LQFP (7x7 mm) 48-LQFP, 7 mm x 7 mm
Tipo de montaje Surface Mount Surface mount
Temperatura de funcionamiento -40C to +125C —
Estado RoHS ROHS3 Compliant —
Debug Interface Single-wire BDM —
Product Type — 8-bit S08 automotive microcontroller
CPU Core — S08 core with HC08 instruction set and BGND instruction
Maximum CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory — 16 KB Flash (16K x 8)
RAM — 1 KB (1K x 8)
I/O Pins — 39
Interrupt and Reset Sources — Up to 32 sources
Oscillator Type — External
Communication Features — CAN and LIN connectivity
Temperature Grade — Automotive
Packaging — Tray
Program Memory Type — Flash
Terminal Count — 48

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