MC9S08DV60AMLF vs MC9S08DV16AMLF Comparação

Comparação detalhada lado a lado de MC9S08DV60AMLF por NXP Semiconductors e MC9S08DV16AMLF por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08DV60AMLF MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP

MC9S08DV60AMLF - 8-Bit 40MHz CAN/LIN MCU 60KB Flash | NXP

MC9S08DV60AMLF ✓ Ativo
NXP Semiconductors
MC9S08DV16AMLF MC9S08DV16AMLF - 40MHz 16KB Flash CAN MCU | NXP | Automotive

MC9S08DV16AMLF - 40MHz 16KB Flash CAN MCU | NXP | Automotive

MC9S08DV16AMLF Nrnd

Comparação de especificações

Parâmetro MC9S08DV60AMLF MC9S08DV16AMLF
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $4,60 $9,17
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors
Series S08 —
Core Processor HCS08 (enhanced HC08 with BGND) —
Core Size 8-bit —
Core Speed 40 MHz (20 MHz bus) —
Program Memory Size 60 KB (60K x 8) Flash —
RAM Size 3 KB —
Supply Voltage Range 2.7 V to 5.5 V —
Number of I/O 53 GPIO + 1 input-only —
Communication Interfaces MSCAN (CAN 2.0A/B), SCI/SPI, LIN master —
ADC 8-channel 10-bit (per datasheet family) 16 channels, 12-bit resolution, 2.5 s conversion-time figure
Timers Multiple TPM (per datasheet family) —
Encapsulamento 48-LQFP (7x7 mm) 48-LQFP, 7 mm x 7 mm
Tipo de montagem Surface Mount Surface mount
Temperatura de operação -40C to +125C —
Status RoHS ROHS3 Compliant —
Debug Interface Single-wire BDM —
Product Type — 8-bit S08 automotive microcontroller
CPU Core — S08 core with HC08 instruction set and BGND instruction
Maximum CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory — 16 KB Flash (16K x 8)
RAM — 1 KB (1K x 8)
I/O Pins — 39
Interrupt and Reset Sources — Up to 32 sources
Oscillator Type — External
Communication Features — CAN and LIN connectivity
Temperature Grade — Automotive
Packaging — Tray
Program Memory Type — Flash
Terminal Count — 48

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