MC9S08DZ60ACLF vs S9S08DZ60F1MLF Comparación
Comparación detallada lado a lado de MC9S08DZ60ACLF por NXP Semiconductors y S9S08DZ60F1MLF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndNXP Semiconductors
S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP
S9S08DZ60F1MLF ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08DZ60ACLF | S9S08DZ60F1MLF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,85 | $4,95 |
| Core | HCS08 (8-bit CISC) | — |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| EEPROM / Emulated EEPROM | Available (size [DATA_NEEDED: EEPROM size]) | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Supply Rails | 3.3 V / 5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | — |
| CAN | 1 x CAN 2.0 A/B | — |
| LIN | Master LIN 2.0 interface | — |
| Communication Peripherals | SCI (SPI), IIC, MSCAN | — |
| Timer / PWM Channels | Multiple (count [DATA_NEEDED: timer/PWM channel count]) | — |
| LCD Driver | Yes (on-chip segment LCD driver) | — |
| Encapsulado | 48-LQFP (7x7 mm) | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] | [DATA_NEEDED: full operating temperature range] |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | MSL 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Estado RoHS | Compliant | [DATA_NEEDED: confirm RoHS lead-free finish] |
| Background Debug Mode (BGND) | Yes (on-chip emulation/debug) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | HC08 with BGND instruction |
| Manufacturer | — | NXP USA Inc. (formerly Freescale Semiconductor) |
| Product Type | — | 8-Bit Microcontroller (MCU) |
| Core Architecture | — | HCS08 (enhanced HCS08 core) |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) FLASH |
| RAM Size | — | 4 KB (4K x 8) |
| Number of I/O Lines | — | 39 |
| Encapsulado / Carcasa | — | 48-LQFP (7x7 mm) |
| Tensión de alimentación | — | 3.3 V / 5 V |
| Terminal Form | — | GULL WING |
| Temperature Grade | — | Automotive (per part suffix 'F' / 'LF') |
| Oscillator Type | — | External (per package options) |
| Peripherals | — | MSCAN (CAN 2.0), SCI, SPI, ADC, Timers |