MC9S08DZ60ACLF vs S9S08DZ60F1MLF Comparaison
Comparaison détaillée côte à côte de MC9S08DZ60ACLF par NXP Semiconductors et S9S08DZ60F1MLF par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndNXP Semiconductors
S9S08DZ60F1MLF - 8-Bit 40MHz HCS08 MCU 60KB Flash 48-LQFP | NXP
S9S08DZ60F1MLF ✓ ActifComparaison des spécifications
| Paramètre | MC9S08DZ60ACLF | S9S08DZ60F1MLF |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,85 | $4,95 |
| Core | HCS08 (8-bit CISC) | — |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory (Flash) | 60 KB (60K x 8) | — |
| RAM | 4 KB | — |
| EEPROM / Emulated EEPROM | Available (size [DATA_NEEDED: EEPROM size]) | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Supply Rails | 3.3 V / 5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | — |
| CAN | 1 x CAN 2.0 A/B | — |
| LIN | Master LIN 2.0 interface | — |
| Communication Peripherals | SCI (SPI), IIC, MSCAN | — |
| Timer / PWM Channels | Multiple (count [DATA_NEEDED: timer/PWM channel count]) | — |
| LCD Driver | Yes (on-chip segment LCD driver) | — |
| Boîtier | 48-LQFP (7x7 mm) | — |
| Température de fonctionnement | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] | [DATA_NEEDED: full operating temperature range] |
| Type de montage | Surface Mount | Surface Mount |
| Niveau MSL | MSL 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Statut RoHS | Compliant | [DATA_NEEDED: confirm RoHS lead-free finish] |
| Background Debug Mode (BGND) | Yes (on-chip emulation/debug) | — |
| Instruction Set | HC08 instruction set with added BGND instruction | HC08 with BGND instruction |
| Manufacturer | — | NXP USA Inc. (formerly Freescale Semiconductor) |
| Product Type | — | 8-Bit Microcontroller (MCU) |
| Core Architecture | — | HCS08 (enhanced HCS08 core) |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 60 KB (60K x 8) FLASH |
| RAM Size | — | 4 KB (4K x 8) |
| Number of I/O Lines | — | 39 |
| Boîtier / Format | — | 48-LQFP (7x7 mm) |
| Tension d'alimentation | — | 3.3 V / 5 V |
| Terminal Form | — | GULL WING |
| Temperature Grade | — | Automotive (per part suffix 'F' / 'LF') |
| Oscillator Type | — | External (per package options) |
| Peripherals | — | MSCAN (CAN 2.0), SCI, SPI, ADC, Timers |