MC9S08EL16CTJ vs S9S08EL32F1CTJ Comparación
Comparación detallada lado a lado de MC9S08EL16CTJ por NXP Semiconductors y S9S08EL32F1CTJ por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08EL16CTJ | S9S08EL32F1CTJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,05 | $5,25 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-bit | — |
| Maximum CPU Frequency | 40 MHz | [DATA_NEEDED: maximum bus frequency MHz] |
| Program Memory Size | 16 KB (16K x 8) Flash | — |
| RAM Size | 1 KB | — |
| EEPROM Size | 512 x 8 (512 bytes) | — |
| Number of I/O | 16 | — |
| Tensión de alimentación | 2.7 V to 5.5 V (3.3 V / 5 V operation) | — |
| Connectivity | I2C, LINbus (via SLIC), SCI (UART), SPI | — |
| Peripherals | LVD, POR, PWM, WDT, SLIC (Slave LIN Interface Controller) | — |
| Encapsulado | 20-pin TSSOP (4.40 mm body width) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40 C to +85 C (industrial) [DATA_NEEDED: exact industrial vs automotive grade] | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Data Converters | [DATA_NEEDED: ADC channels and resolution] | — |
| Oscillator | Internal + external crystal support [DATA_NEEDED: internal oscillator tolerance] | — |
| Estado RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status from manufacturer page] |
| Product Type | — | 8-bit Microcontroller (MCU) |
| Core Family | — | HCS08 |
| Program Memory (Flash) | — | 32 KB |
| Data Memory (RAM) | — | 1 KB |
| CPU Core | — | Freescale/NXP HCS08, 8-bit |
| Package Type | — | 144-pin LFQFP (FJ-type) |
| Package Code | — | LFQFP |
| Terminal Form | — | GULL WING |
| Package Shape | — | SQUARE |
| Rango de temperatura de funcionamiento | — | -40 C to +85 C |
| Communication Interfaces | — | SPI |
| On-Chip Analog Comparator | — | Yes |
| On-Chip Debug | — | BDM (Background Debug Mode) |