MC9S08EL16CTJ vs S9S08EL32F1CTJ Comparaison
Comparaison détaillée côte à côte de MC9S08EL16CTJ par NXP Semiconductors et S9S08EL32F1CTJ par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08EL16CTJ | S9S08EL32F1CTJ |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,05 | $5,25 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-bit | — |
| Maximum CPU Frequency | 40 MHz | [DATA_NEEDED: maximum bus frequency MHz] |
| Program Memory Size | 16 KB (16K x 8) Flash | — |
| RAM Size | 1 KB | — |
| EEPROM Size | 512 x 8 (512 bytes) | — |
| Number of I/O | 16 | — |
| Tension d'alimentation | 2.7 V to 5.5 V (3.3 V / 5 V operation) | — |
| Connectivity | I2C, LINbus (via SLIC), SCI (UART), SPI | — |
| Peripherals | LVD, POR, PWM, WDT, SLIC (Slave LIN Interface Controller) | — |
| Boîtier | 20-pin TSSOP (4.40 mm body width) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | -40 C to +85 C (industrial) [DATA_NEEDED: exact industrial vs automotive grade] | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Data Converters | [DATA_NEEDED: ADC channels and resolution] | — |
| Oscillator | Internal + external crystal support [DATA_NEEDED: internal oscillator tolerance] | — |
| Statut RoHS | Compliant (per distributor listings) | [DATA_NEEDED: RoHS status from manufacturer page] |
| Product Type | — | 8-bit Microcontroller (MCU) |
| Core Family | — | HCS08 |
| Program Memory (Flash) | — | 32 KB |
| Data Memory (RAM) | — | 1 KB |
| CPU Core | — | Freescale/NXP HCS08, 8-bit |
| Package Type | — | 144-pin LFQFP (FJ-type) |
| Package Code | — | LFQFP |
| Terminal Form | — | GULL WING |
| Package Shape | — | SQUARE |
| Plage de température de fonctionnement | — | -40 C to +85 C |
| Communication Interfaces | — | SPI |
| On-Chip Analog Comparator | — | Yes |
| On-Chip Debug | — | BDM (Background Debug Mode) |