MC9S08PA16VTG vs MC9S08GT60ACFBE Comparación
Comparación detallada lado a lado de MC9S08PA16VTG por NXP Semiconductors y MC9S08GT60ACFBE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08PA16VTG | MC9S08GT60ACFBE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,10 | $9,85 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Maximum CPU Speed | 20 MHz | — |
| Program Memory Size | 16 KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 2 KB | — |
| EEPROM Size | 256 bytes | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 14 | — |
| Connectivity | I2C, LINbus, SPI, UART/USART | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 10-bit, multi-channel | 8-channel, 10-bit |
| Rango de temperatura de funcionamiento | -40C to +105C | — |
| Encapsulado | 16-TSSOP (0.173, 4.40 mm Width) | 44-QFP (10x10 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) | — |
| Core Architecture | — | HCS08 (enhanced S08) |
| CPU Bit Width | — | 8-bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| I/O Pins | — | 34 |
| Tensión de alimentación | — | 1.8 V to 3.6 V |
| Communication Interfaces | — | 1x SCI, 1x SPI, 1x I2C |
| Timers | — | Multiple TPM channels [DATA_NEEDED: exact channel count] |
| Temperatura de funcionamiento | — | -40 C to +85 C (industrial) |
| Instruction Set | — | CISC, HC08 with BGND |
| Interrupt Sources | — | Up to 32 |
| Pull-ups | — | Software-selectable on ports |
| Estado RoHS | — | Compliant |