MC9S08QG4CDNE vs MC9S08QA4CDNE Comparación
Comparación detallada lado a lado de MC9S08QG4CDNE por NXP Semiconductors y MC9S08QA4CDNE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QG4CDNE | MC9S08QA4CDNE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $1,98 |
| Product Type | 8-bit HCS08 microcontroller | 8-bit HCS08 microcontroller |
| CPU Architecture | S08 core with HCS08 instruction set | HCS08 with HC08 instruction set and BGND instruction |
| Maximum Clock Speed | 20 MHz | — |
| Flash Memory | 4 KB (4K x 8) | 4 KB (4K × 8 bits) |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.3 V |
| I/O Port Count | 6 ports | — |
| Encapsulado | 8-pin SOIC | 8-pin SOIC |
| Package Reference | MS-012AA | — |
| Tipo de montaje | Surface mount | Surface Mount |
| Instruction Set | HCS08 with added BGND instruction | — |
| Debug Support | Background debugging system with breakpoint capability | — |
| Architecture Family | S08QG | — |
| Product Category | Microcontroller IC | — |
| Estado RoHS | RoHS compliant | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| RAM | [DATA_NEEDED: RAM capacity] | — |
| EEPROM | [DATA_NEEDED: EEPROM capacity] | — |
| ADC | [DATA_NEEDED: ADC specification] | — |
| Timer | [DATA_NEEDED: timer specification] | — |
| Serial Interfaces | [DATA_NEEDED: serial interface details] | — |
| Maximum I/O Frequency | [DATA_NEEDED: maximum I/O frequency] | — |
| Maximum CPU Frequency | — | 20 MHz |
| Interrupt and Reset Sources | — | Up to 32 sources |
| Low-Power Modes | — | 2 very-low-power stop modes |
| Low-Voltage Detection | — | Supported |
| Temperatura de funcionamiento | — | -40°C to +85°C |
| Background Debugging | — | Supported |
| Breakpoint Capability | — | Single breakpoint on-chip during in-circuit debugging; additional on-chip breakpoints stated by retrieved data |
| S08 Core Speed | — | 40 MHz core speed; 20 MHz bus speed |
| Manufacturer | — | NXP Semiconductors |
| Estado del ciclo de vida | — | End of Life |
| RoHS | — | unknown |
| REACH | — | unknown |
| AEC-Q100 | — | unknown |
| Lead-Free | — | unknown |