MC9S08QG4CDNE vs MC9S08QA4CDNE Comparaison
Comparaison détaillée côte à côte de MC9S08QG4CDNE par NXP Semiconductors et MC9S08QA4CDNE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QG4CDNE | MC9S08QA4CDNE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $1,98 |
| Product Type | 8-bit HCS08 microcontroller | 8-bit HCS08 microcontroller |
| CPU Architecture | S08 core with HCS08 instruction set | HCS08 with HC08 instruction set and BGND instruction |
| Maximum Clock Speed | 20 MHz | — |
| Flash Memory | 4 KB (4K x 8) | 4 KB (4K × 8 bits) |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.3 V |
| I/O Port Count | 6 ports | — |
| Boîtier | 8-pin SOIC | 8-pin SOIC |
| Package Reference | MS-012AA | — |
| Type de montage | Surface mount | Surface Mount |
| Instruction Set | HCS08 with added BGND instruction | — |
| Debug Support | Background debugging system with breakpoint capability | — |
| Architecture Family | S08QG | — |
| Product Category | Microcontroller IC | — |
| Statut RoHS | RoHS compliant | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| RAM | [DATA_NEEDED: RAM capacity] | — |
| EEPROM | [DATA_NEEDED: EEPROM capacity] | — |
| ADC | [DATA_NEEDED: ADC specification] | — |
| Timer | [DATA_NEEDED: timer specification] | — |
| Serial Interfaces | [DATA_NEEDED: serial interface details] | — |
| Maximum I/O Frequency | [DATA_NEEDED: maximum I/O frequency] | — |
| Maximum CPU Frequency | — | 20 MHz |
| Interrupt and Reset Sources | — | Up to 32 sources |
| Low-Power Modes | — | 2 very-low-power stop modes |
| Low-Voltage Detection | — | Supported |
| Température de fonctionnement | — | -40°C to +85°C |
| Background Debugging | — | Supported |
| Breakpoint Capability | — | Single breakpoint on-chip during in-circuit debugging; additional on-chip breakpoints stated by retrieved data |
| S08 Core Speed | — | 40 MHz core speed; 20 MHz bus speed |
| Manufacturer | — | NXP Semiconductors |
| Statut du cycle de vie | — | End of Life |
| RoHS | — | unknown |
| REACH | — | unknown |
| AEC-Q100 | — | unknown |
| Lead-Free | — | unknown |