MC9S08QG8CFKE vs MC9S08QD4CSC Comparación
Comparación detallada lado a lado de MC9S08QG8CFKE por NXP Semiconductors y MC9S08QD4CSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08QG8CFKE - 8KB Flash 20MHz S08 8-bit MCU | NXP 24-QFN
MC9S08QG8CFKE ⚠ Última compra
Comparación de especificaciones
| Parámetro | MC9S08QG8CFKE | MC9S08QD4CSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,58 | $0,00 |
| Product Type | 8-bit Microcontroller (MCU) | — |
| Core | HCS08 (enhanced HC08 with BGND instruction) | — |
| Program Memory (Flash) | 8 KB | — |
| RAM | 512 B | 256 B |
| Maximum CPU Frequency | 20 MHz | — |
| Supply Voltage Range | 1.8 V to 3.6 V | — |
| Encapsulado | 24-QFN-EP (4x4 mm) | 8-SOIC |
| Number of I/O Pins | 6 (per digchip summary) [DATA_NEEDED: full port count per datasheet] | — |
| ADC | 10-bit ADC [DATA_NEEDED: channel count] | — |
| Serial Interfaces | I2C, SPI, SCI (UART) | — |
| Timers | TPM x2 [DATA_NEEDED: channel configuration] | — |
| Rango de temperatura de funcionamiento | -40C to +85C [DATA_NEEDED: confirm industrial vs extended] | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | MSL3 [DATA_NEEDED: exact MSL level per datasheet] | — |
| Estado RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08), 8-bit CISC |
| Core Size | — | 8-bit |
| Frecuencia de reloj máxima | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| Tensión de alimentación | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Packaging | — | Tube |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | — | End of Life (per NXP product page) |