MC9S12GC64MFAE vs MC9S12GC32MFAE Comparación
Comparación detallada lado a lado de MC9S12GC64MFAE por NXP Semiconductors y MC9S12GC32MFAE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S12GC64MFAE | MC9S12GC32MFAE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $10,10 | $8,44 |
| Core Architecture | HCS12 (16-bit) | — |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 64 KB (64K x 8) | 32 KB (32K x 8) |
| Supply Voltage Range | 2.97 V to 5.5 V | — |
| Encapsulado | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) |
| Recuento de pines | 48 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (automotive) | [DATA_NEEDED: operating temperature grade] |
| Family | S12GC | — |
| On-chip Voltage Regulator | Yes (bandgap-based, internal VDD generation) | — |
| PLL | Yes (internal phase-lock loop) | — |
| Data Path Width | 16-bit | — |
| Debug Interface | BDM (Background Debug Mode) | BDM (single-wire background debug) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Core | — | HCS12 (16-bit) |
| CPU Family | — | S12GC |
| RAM | — | 2 KB |
| EEPROM | — | 1 KB |
| Maximum Bus Clock | — | 25 MHz (50 MHz core via PLL) |
| Tensión de alimentación | — | 2.97 V to 5.5 V |
| Internal Voltage Regulator | — | On-chip bandgap Vreg (2.5 V core) |
| ADC | — | 10-bit |
| PWM / Timer Channels | — | 8 channels |
| SCI (UART) | — | Up to 2 |
| SPI | — | 1 |
| GPIO | — | Up to 60 |