MC9S12XDT256CPV vs MC9S12XDT512MAA Comparación
Comparación detallada lado a lado de MC9S12XDT256CPV por NXP Semiconductors y MC9S12XDT512MAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV Nrnd
Comparación de especificaciones
| Parámetro | MC9S12XDT256CPV | MC9S12XDT512MAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,25 | $0,00 |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | — |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| Tensión de alimentación | 2.5 V / 5 V (dual-range) | [DATA_NEEDED: supply voltage range] |
| Encapsulado | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | 80-QFP (14x14 mm), Square, Gull Wing |
| Recuento de pines | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | — |
| PWM Channels | 4 x 8/16-bit PWM | — |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Temperatura de funcionamiento | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Sin halógenos | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |