MC9S12XDT256CPV vs MC9S12XDT512MAA Comparaison
Comparaison détaillée côte à côte de MC9S12XDT256CPV par NXP Semiconductors et MC9S12XDT512MAA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S12XDT256CPV - 16-bit HCS12X MCU, 256KB Flash, 112-LQFP | NXP
MC9S12XDT256CPV Nrnd
Comparaison des spécifications
| Paramètre | MC9S12XDT256CPV | MC9S12XDT512MAA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $12,25 | $0,00 |
| Core | HCS12X (16-bit CISC with XGATE co-processor) | — |
| Family | S12XD | — |
| Program Memory | 256 KB Flash | — |
| EEPROM | 4 KB | — |
| RAM | 12 KB | — |
| CPU Bus Frequency | 25 MHz / 40 MHz (max) | — |
| XGATE Co-processor | 80 MHz, RISC-style peripheral engine | — |
| Tension d'alimentation | 2.5 V / 5 V (dual-range) | [DATA_NEEDED: supply voltage range] |
| Boîtier | 112-LQFP (20 x 20 mm, 0.65 mm pitch) | 80-QFP (14x14 mm), Square, Gull Wing |
| Nombre de broches | 112 | — |
| Temperature Grade | Industrial (-40C to +85C) | — |
| Type de montage | Surface Mount | Surface Mount |
| CAN Modules | Up to 2 x CAN 2.0A/B (msCAN) | — |
| SCI / SPI / I2C | 2 x SCI, 2 x SPI, 1 x I2C | — |
| ADC | 8-channel, 10-bit ATD | — |
| PWM Channels | 4 x 8/16-bit PWM | — |
| Timers | ECT (Enhanced Capture Timer), PIT, RTI | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Température de fonctionnement | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Sans halogène | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |