MC9S12XDT512MAA vs MC9S12DT256CMPV Comparación
Comparación detallada lado a lado de MC9S12XDT512MAA por NXP Semiconductors y MC9S12DT256CMPV por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ ActivoComparación de especificaciones
| Parámetro | MC9S12XDT512MAA | MC9S12DT256CMPV |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $11,50 |
| Core Processor | HCS12X | — |
| Core Size | 16-Bit | — |
| Maximum Clock Speed | 80 MHz | — |
| Program Memory Size | 512KB (512K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 20KB | — |
| EEPROM Size | 4KB | — |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of I/O | 59 | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | — |
| Temperatura de funcionamiento | -40C to +125C (TA) | — |
| Encapsulado | 80-QFP (14x14 mm), Square, Gull Wing | LQFP-112 |
| Tipo de montaje | Surface Mount | Surface Mount (LQFP, gull-wing) |
| Packaging Method | Tray | — |
| Sin halógenos | Compliant | — |
| ECCN | 3A991.a.2 | — |
| Estimated EOL Date | 2028 | — |
| Core Architecture | — | HCS12 (S12) 16-bit CISC |
| Bus Frequency | — | Up to 50 MHz |
| Program Flash | — | 256 KB |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| Recuento de pines | — | 112 |
| Operating Voltage | — | 5.0 V (4.5 V to 5.5 V) |
| Temperature Grade | — | Automotive (-40C to +125C) |
| ADC | — | 2 x 8-channel 10-bit |
| PWM Channels | — | 8 channels |
| Enhanced Capture Timer | — | 8-channel (ECT) |
| SCI (UART) Interfaces | — | 2 |
| SPI Interfaces | — | 2 |
| CAN Modules | — | 1 x msCAN (CAN 2.0A/B) |
| GPIO (Approx.) | — | 20 discrete digital I/O lines |
| Debug Interface | — | Background Debug Mode (BDM) |
| Estado RoHS | — | Compliant (per NXP product page) |