MC9S12XDT512MAA vs MC9S12DT256CMPV Comparaison
Comparaison détaillée côte à côte de MC9S12XDT512MAA par NXP Semiconductors et MC9S12DT256CMPV par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ ActifComparaison des spécifications
| Paramètre | MC9S12XDT512MAA | MC9S12DT256CMPV |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $11,50 |
| Core Processor | HCS12X | — |
| Core Size | 16-Bit | — |
| Maximum Clock Speed | 80 MHz | — |
| Program Memory Size | 512KB (512K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 20KB | — |
| EEPROM Size | 4KB | — |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of I/O | 59 | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Tension d'alimentation | [DATA_NEEDED: supply voltage range] | — |
| Température de fonctionnement | -40C to +125C (TA) | — |
| Boîtier | 80-QFP (14x14 mm), Square, Gull Wing | LQFP-112 |
| Type de montage | Surface Mount | Surface Mount (LQFP, gull-wing) |
| Packaging Method | Tray | — |
| Sans halogène | Compliant | — |
| ECCN | 3A991.a.2 | — |
| Estimated EOL Date | 2028 | — |
| Core Architecture | — | HCS12 (S12) 16-bit CISC |
| Bus Frequency | — | Up to 50 MHz |
| Program Flash | — | 256 KB |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| Nombre de broches | — | 112 |
| Operating Voltage | — | 5.0 V (4.5 V to 5.5 V) |
| Temperature Grade | — | Automotive (-40C to +125C) |
| ADC | — | 2 x 8-channel 10-bit |
| PWM Channels | — | 8 channels |
| Enhanced Capture Timer | — | 8-channel (ECT) |
| SCI (UART) Interfaces | — | 2 |
| SPI Interfaces | — | 2 |
| CAN Modules | — | 1 x msCAN (CAN 2.0A/B) |
| GPIO (Approx.) | — | 20 discrete digital I/O lines |
| Debug Interface | — | Background Debug Mode (BDM) |
| Statut RoHS | — | Compliant (per NXP product page) |