MCHC908QY4MDWER vs MCHC908QT4CDWE Comparación
Comparación detallada lado a lado de MCHC908QY4MDWER por NXP Semiconductors y MCHC908QT4CDWE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCHC908QY4MDWER | MCHC908QT4CDWE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,90 | $4,20 |
| Manufacturer | NXP Semiconductors | — |
| Core Processor | HC08 8-bit core | — |
| Frecuencia de reloj máxima | 8 MHz | — |
| Program Memory Size | 4 KB (4K x 8) Flash | — |
| RAM Size | 128 x 8 bits | — |
| ADC | Integrated ADC | 10-bit, multiple channels |
| PWM | Integrated PWM peripheral | — |
| Low-Voltage Detection | LVD peripheral | — |
| Power-On Reset | POR peripheral | — |
| Number of I/O Pins | 13 | — |
| Architecture | CISC with Von Neumann architecture | Von Neumann, CISC |
| Family | HC08Q / M68HC08 | M68HC08 (HC08Q sub-family) |
| Encapsulado | 16-SOIC | 8-pin SOIC (EIAJ, 5.30 mm body width) |
| Package Width | 7.50 mm | — |
| Part Status | Not For New Designs | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Core | — | CPU08 (8-bit CISC) |
| Program Memory | — | 4 KB Flash |
| RAM | — | 128 bytes |
| Maximum Bus Clock | — | 8 MHz |
| Operating Voltage | — | 3.0 V to 5.5 V (3.3 V / 5 V nominal) |
| Timers | — | Multi-function timer interface (TPM/MTIM family) |
| Communication | — | Enhanced Serial Communications Interface (ESCI), SPI |
| Tipo de montaje | — | Surface Mount |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |
| Security | — | Program memory security fuse |
| Temperatura de funcionamiento | — | -40C to +85C (industrial, [DATA_NEEDED: confirm grade letter]) |