MCHC908QY4MDWER vs MCHC908QT4CDWE Comparaison
Comparaison détaillée côte à côte de MCHC908QY4MDWER par NXP Semiconductors et MCHC908QT4CDWE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MCHC908QY4MDWER | MCHC908QT4CDWE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,90 | $4,20 |
| Manufacturer | NXP Semiconductors | — |
| Core Processor | HC08 8-bit core | — |
| Fréquence d'horloge maximale | 8 MHz | — |
| Program Memory Size | 4 KB (4K x 8) Flash | — |
| RAM Size | 128 x 8 bits | — |
| ADC | Integrated ADC | 10-bit, multiple channels |
| PWM | Integrated PWM peripheral | — |
| Low-Voltage Detection | LVD peripheral | — |
| Power-On Reset | POR peripheral | — |
| Number of I/O Pins | 13 | — |
| Architecture | CISC with Von Neumann architecture | Von Neumann, CISC |
| Family | HC08Q / M68HC08 | M68HC08 (HC08Q sub-family) |
| Boîtier | 16-SOIC | 8-pin SOIC (EIAJ, 5.30 mm body width) |
| Package Width | 7.50 mm | — |
| Part Status | Not For New Designs | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Core | — | CPU08 (8-bit CISC) |
| Program Memory | — | 4 KB Flash |
| RAM | — | 128 bytes |
| Maximum Bus Clock | — | 8 MHz |
| Operating Voltage | — | 3.0 V to 5.5 V (3.3 V / 5 V nominal) |
| Timers | — | Multi-function timer interface (TPM/MTIM family) |
| Communication | — | Enhanced Serial Communications Interface (ESCI), SPI |
| Type de montage | — | Surface Mount |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |
| Security | — | Program memory security fuse |
| Température de fonctionnement | — | -40C to +85C (industrial, [DATA_NEEDED: confirm grade letter]) |