MCIMX6U1AVM08AB vs MCIMX6S4AVM08AB Comparación
Comparación detallada lado a lado de MCIMX6U1AVM08AB por NXP Semiconductors y MCIMX6S4AVM08AB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCIMX6U1AVM08AB | MCIMX6S4AVM08AB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $32,40 | $22,40 |
| Core Architecture | ARM Cortex-A9 (dual-core) | — |
| Maximum Core Frequency | 800 MHz | — |
| Ancho del bus de datos | 32-bit | — |
| Family | i.MX 6DualLite (i.MX6DL) | — |
| Encapsulado / Carcasa | 624-MAPBGA (21x21 mm) | — |
| Recuento de pines | 624 | — |
| Tensión de alimentación | 1.8 V / 2.5 V / 2.8 V / 3.15 V (multi-rail) | 1.8 V / 2.5 V / 2.8 V / 3.15 V |
| Temperature Grade | Automotive | — |
| L1 Cache (per core) | 32 KB I-cache + 32 KB D-cache | — |
| L2 Cache | 512 KB unified | 512 KB unified |
| NEON SIMD | Yes | — |
| Memory Interface | LPDDR2, LPDDR3, DDR3, LV-DDR3 | 32-bit DDR3 / LPDDR2 |
| Tipo de montaje | Surface Mount (BGA) | — |
| Nivel MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Part Number | — | MCIMX6S4AVM08AB |
| Core Processor | — | ARM Cortex-A9 |
| Number of Cores | — | 1 |
| Bus Width | — | 32-bit |
| Speed | — | 800 MHz |
| Series | — | i.MX 6Solo |
| Encapsulado | — | 624-MAPBGA (21x21 mm, 0.8 mm pitch) |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| GPU | — | GC880 3D + 2D (OpenGL ES 2.0, OpenVG 1.1) |
| Video Decoder (VPU) | — | H.264 BP / MPEG-4 / H.263 / MJPEG, up to 1080p30 |
| Display Interface | — | 24-bit parallel RGB LCD up to WXGA (1366x768) |
| Camera Interface | — | 2x MIPI-CSI |
| USB | — | 3x USB 2.0 (1x OTG with PHY) |
| PCIe | — | 1x PCIe 2.0 (x1 lane) |
| Ethernet | — | 10/100/1000 MAC |
| SD/MMC | — | 2x SD3.0 / MMC4.4 |
| Temperatura de funcionamiento | — | -40C to +125C (automotive) |