MCR908JL3ECDWE vs MC908JL3EMDWE Comparación
Comparación detallada lado a lado de MCR908JL3ECDWE por NXP Semiconductors y MC908JL3EMDWE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MCR908JL3ECDWE - HC08 8-Bit 8MHz 4KB Flash MCU | NXP SOIC-28
MCR908JL3ECDWE ⚠ Última compraNXP Semiconductors
MC908JL3EMDWE - HC08 8-bit MCU 4KB Flash 128B RAM 28-SOIC | NXP
MC908JL3EMDWE ⚠ Última compraComparación de especificaciones
| Parámetro | MCR908JL3ECDWE | MC908JL3EMDWE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,45 | $2,78 |
| Product Type | Microcontroller (MCU) | 8-bit Microcontroller (MCU) |
| Core Architecture | HC08 (M68HC08 Family, CISC) | HC08 (M68HC08 family), 8-bit CISC |
| Ancho del bus de datos | 8-bit | — |
| CPU Clock Speed | 8 MHz | 8 MHz |
| Program Memory | 4 KB Flash (MCR indicates ROM/prefix-coded) | 4 KB Flash (4K x 8) |
| Tensión de alimentación | 3.3 V / 5 V | — |
| Temperatura de funcionamiento | -40 C to +85 C [DATA_NEEDED: exact range from datasheet] | -40C to +85C [DATA_NEEDED: industrial vs automotive grade confirmation] |
| Encapsulado | 28-pin SOIC W (wide-body, 7.5 mm body width) | 28-SOIC W (wide-body, 0.295 inch / 7.50 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL classification] | [DATA_NEEDED: MSL rating] |
| Estado RoHS | Compliant (PB-FREE FINISHED GOODS per datasheet) | [DATA_NEEDED: RoHS compliance - NXP lists part as EOL, third-party stockists continue to ship] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free reflow compatibility] |
| Family | HC08JL Family (JL3 member) | — |
| Programmable | No - ROM/prefix-coded (MCR variant) | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Manufacturer | — | NXP USA Inc. (formerly Freescale Semiconductor) |
| RAM | — | 128 B |
| Supply Voltage Range | — | 2.7 V to 5.5 V (data shown for 5 V operation) |
| A/D Converter | — | 10-bit, up to 8 channels |
| Timers | — | 2 x 16-bit timer modules [DATA_NEEDED: precise channel count per module] |
| Communication Interfaces | — | SCI (UART) and SPI [DATA_NEEDED: number of independent SPI/SCI modules] |
| Recuento de pines | — | 28 |