MK10DX64VMC7 vs MK21DN512AVLK5 Comparación
Comparación detallada lado a lado de MK10DX64VMC7 por NXP Semiconductors y MK21DN512AVLK5 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MK10DX64VMC7 | MK21DN512AVLK5 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,72 | $4,80 |
| Core Processor | ARM Cortex-M4 | ARM Cortex-M4 |
| Core Size | 32-Bit | 32-Bit |
| Frecuencia de reloj máxima | 72 MHz | 50 MHz |
| Flash Memory | 64 KB (64K x 8) | 512 KB (512K x 8) |
| SRAM | [DATA_NEEDED: SRAM size] | 64 KB |
| Product Family | Kinetis K10 (K1x Baseline Series) | Kinetis K21 (K21D sub-family) |
| Encapsulado | 121-MAPBGA (8x8 mm) | 80-LQFP (12x12 mm) |
| Number of Terminals | 121 | — |
| Terminal Form | Ball (BGA) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | 1.8 V / 2.5 V / 3.3 V |
| Peripherals | Analog, communication, timing and control peripherals | ADC, DAC, PWM, POR, WDT, DMA, CAN, UART, SPI, I2C |
| Low-Power Modes | Flexible low-power options | — |
| Analog Integration | High-precision analog integration | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| USB | — | Full-Speed USB 2.0 device/OTG controller |
| Security Features | — | Hardware encryption, anti-tamper detection (DryIce) |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Temperatura de funcionamiento | — | -40C to +105C (AEC-Q100 grade, per Arrow data) |
| Qualification | — | Automotive AEC-Q100 (per Arrow product listing) |
| Packaging | — | Tray |