MPC565CVR56 vs MPC563MZP56 Comparación
Comparación detallada lado a lado de MPC565CVR56 por NXP Semiconductors y MPC563MZP56 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC565CVR56 | MPC563MZP56 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Unknown | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $17,95 |
| Architecture | Power Architecture, 32-bit | — |
| Processor Core | Single core | — |
| Product Family | MPC5xx / MPC500 family | — |
| Manufacturer Frequency Listing | 40 MHz | — |
| Distributor Frequency Listing | 56 MHz | — |
| Flash Memory | 1 MB, listed as 1M x 8 by distributor sources | — |
| Program Memory Type | Embedded Flash | — |
| Floating-Point Unit | Integrated floating-point unit | — |
| Peripheral Set | Advanced peripheral set | — |
| Automotive Grade | Automotive Grade | — |
| Temperatura de funcionamiento | -40 °C to +85 °C | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 388-PBGA | 388-PBGA (27 x 27 mm) |
| Package Ball Count | 388 balls | — |
| Package Dimensions | 27 mm x 27 mm | — |
| Tipo de montaje | Surface mount, ball-grid array | Surface Mount (BGA) |
| Supplier Inventory Listing | 5,664 pieces on Heisener listing | — |
| Unit Price Listing | $139.2941 per unit on Heisener listing | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Core Architecture | — | PowerPC MPC5xx (32-bit) |
| Maximum CPU Frequency | — | 56 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| RAM Size | — | 36 KB |
| Operating Voltage | — | 5 V (typical) |
| Number of I/O Pins | — | [DATA_NEEDED: I/O count] |
| Temperature Grade | — | Standard (P) |
| Peripherals | — | Peripheral pin multiplexing, CAN, SPI, serial interfaces |
| Code Compression | — | Yes (on-chip) |
| Intermodule Bus | — | Common IMB |
| Debug Interface | — | Background Debug Mode (BDM) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Manufacturer | — | NXP USA Inc. (formerly Freescale/Motorola) |