MPC565CVR56 vs MPC563MZP56 Vergleich

Detaillierter Direktvergleich von MPC565CVR56 von NXP Semiconductors und MPC563MZP56 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC565CVR56 MPC565CVR56 - 32-Bit 56 MHz Automotive MCU | NXP

MPC565CVR56 - 32-Bit 56 MHz Automotive MCU | NXP

MPC565CVR56 Unknown
NXP Semiconductors
MPC563MZP56 MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 Nrnd

Spezifikationsvergleich

Parameter MPC565CVR56 MPC563MZP56
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Unknown NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $17,95
Architecture Power Architecture, 32-bit —
Processor Core Single core —
Product Family MPC5xx / MPC500 family —
Manufacturer Frequency Listing 40 MHz —
Distributor Frequency Listing 56 MHz —
Flash Memory 1 MB, listed as 1M x 8 by distributor sources —
Program Memory Type Embedded Flash —
Floating-Point Unit Integrated floating-point unit —
Peripheral Set Advanced peripheral set —
Automotive Grade Automotive Grade —
Betriebstemperatur -40 °C to +85 °C [DATA_NEEDED: operating temperature range]
Gehäuse 388-PBGA 388-PBGA (27 x 27 mm)
Package Ball Count 388 balls —
Package Dimensions 27 mm x 27 mm —
Montageart Surface mount, ball-grid array Surface Mount (BGA)
Supplier Inventory Listing 5,664 pieces on Heisener listing —
Unit Price Listing $139.2941 per unit on Heisener listing —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant (per distributor listing)
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Core Architecture — PowerPC MPC5xx (32-bit)
Maximum CPU Frequency — 56 MHz
Program Memory (Flash) — 512 KB (512K x 8)
RAM Size — 36 KB
Operating Voltage — 5 V (typical)
Number of I/O Pins — [DATA_NEEDED: I/O count]
Temperature Grade — Standard (P)
Peripherals — Peripheral pin multiplexing, CAN, SPI, serial interfaces
Code Compression — Yes (on-chip)
Intermodule Bus — Common IMB
Debug Interface — Background Debug Mode (BDM)
MSL-Level — [DATA_NEEDED: MSL rating]
Manufacturer — NXP USA Inc. (formerly Freescale/Motorola)

Datenblätter & Ressourcen

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