MPC565MVR56 vs MPCZ565MVR56 Comparación
Comparación detallada lado a lado de MPC565MVR56 por NXP Semiconductors y MPCZ565MVR56 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPCZ565MVR56 - 32-bit Power Arch MCU, 1MB Flash, 40MHz | NXP
MPCZ565MVR56 ObsoleteComparación de especificaciones
| Parámetro | MPC565MVR56 | MPCZ565MVR56 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,10 | $52,75 |
| Core Processor | PowerPC MPC5xx | — |
| Core Size | 32-Bit | — |
| Frecuencia de reloj máxima | 56 MHz | 40 MHz |
| Flash Memory | 1 MB (1M x 8) | — |
| Instruction Set Architecture | Power Architecture | — |
| Floating Point Unit | Yes (integrated) | Yes (IEEE 754) |
| Analog Channels | 40 total via two AMUX modules | — |
| Serial Interfaces | 2 x queued serial multichannel modules (QSPI + serial controllers) | — |
| Product Family | MPC500 | — |
| Encapsulado | 388-PBGA (27 x 27 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (automotive grade) | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage] | — |
| SRAM Size | [DATA_NEEDED: SRAM size] | — |
| Peripherals | Time processor unit, system interface unit, [DATA_NEEDED: full peripheral list] | — |
| Estado RoHS | See compliance_info | — |
| Estado del ciclo de vida | End of Life (per NXP product page) | — |
| Core Architecture | — | Power Architecture (MPC500 family) |
| Ancho del bus de datos | — | 32-bit |
| Program Memory Size | — | 1 MB Flash |
| RAM Size | — | 64 KB [DATA_NEEDED: exact value] |
| Supply Voltage Range | — | [DATA_NEEDED: Vdd/Vdd range] |
| Rango de temperatura de funcionamiento | — | -40C to +125C |
| Encapsulado / Carcasa | — | 388-ball PBGA |
| Number of I/O Pins | — | [DATA_NEEDED: exact I/O count] |
| CAN Controllers | — | 2 (CAN 2.0B) |
| ADC Channels | — | 40 (QADC) |
| Timers | — | 32 channels eMIOS + TPU [DATA_NEEDED: exact TPU count] |
| Debug Interface | — | JTAG / OnCE / BDM |
| Nivel de sensibilidad a la humedad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260C (40s max) |
| Terminal Finish | — | Tin Silver Copper (e1 per JESD-609) |
| Automotive Grade | — | Yes |
| Process Technology | — | 0.25 micron CMOS |