MPC8247VRTIEA vs MPC8250ACZQIHBC Comparación
Comparación detallada lado a lado de MPC8247VRTIEA por NXP Semiconductors y MPC8250ACZQIHBC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8247VRTIEA - PowerQUICC II 400MHz Communications MPU | NXP
MPC8247VRTIEA ⚠ Última compraNXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC ObsoleteComparación de especificaciones
| Parámetro | MPC8247VRTIEA | MPC8250ACZQIHBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,25 | $99,50 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II |
| Core Architecture | PowerPC G2_LE (603e class) | PowerPC 603e, 32-Bit RISC |
| Maximum Core Frequency | 400 MHz | — |
| Performance | 760 MIPS | — |
| Ancho del bus de datos | 32 bit | 64-Bit |
| Core | 603e | — |
| Processor Series | MPC8xxx | — |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| Core Supply Voltage | 1.425 V to 1.575 V | — |
| I/O Supply Voltage | 3.3 V | — |
| Integrated Ethernet MAC | 2x 10/100 Fast Ethernet | — |
| USB Interface | USB 1.1 Host/Device | — |
| PCI Interface | PCI 2.2 | — |
| Encapsulado | 516-PBGA (27x27 mm) | — |
| Temperatura de funcionamiento | 0 C to +105 C | -40C to +105C (industrial) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Process Technology | 0.13 um HiP7 | 0.25 um CMOS |
| Communications Processor Module | Yes (CPM with 3 SCCs) | — |
| Core Processor | — | PowerPC G2 |
| Clock Speed | — | 200 MHz |
| Number of Cores | — | 1 (CPU) + 1 CPM |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | TEPBGA / Plastic BGA |
| Recuento de pines | — | 516 |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Instruction Cache | — | 32 KB |
| Data Cache | — | 32 KB |
| Integrated Peripheral | — | PCI bridge, CPM (communications processor module) |
| Nivel MSL | — | 3 (168 hours) |
| Lead Free | — | Yes (per datasheet package code) |