MPC8250AVRIHBC vs MPC8270VRMIBA Comparación
Comparación detallada lado a lado de MPC8250AVRIHBC por NXP Semiconductors y MPC8270VRMIBA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8250AVRIHBC - PowerQUICC II MPC82xx 200MHz MPU BGA-516 | NXP
MPC8250AVRIHBC ⚠ Última compraNXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC8250AVRIHBC | MPC8270VRMIBA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $95,75 |
| Architecture | PowerPC G2 (PowerQUICC II) | — |
| Core | PowerPC 32-bit, 1 core | — |
| Ancho del bus de datos | 64-bit | — |
| Instruction Set | RISC | — |
| Core Clock Speed | 200 MHz | — |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Package Type | BGA (Plastic, Lead-Free) | — |
| Package Code | 516-PBGA | — |
| Package Dimensions | 27 x 27 mm, 2.25 mm height | — |
| Ball Pitch | 1.0 mm | — |
| Recuento de pines | 516 | — |
| Rango de temperatura de funcionamiento | -40C to +105C (Industrial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Family | MPC82xx (PowerQUICC II) | — |
| Communications Peripherals | FCC, MCC, SCC, SMC controllers (CPM) | — |
| Estado RoHS | Compliant (Lead-Free PBGA) | [DATA_NEEDED: RoHS status] |
| Core Architecture | — | PowerPC G2_LE, 32-bit |
| Core Frequency | — | 266 MHz |
| Series | — | PowerQUICC II (MPC82xx) |
| Number of Cores | — | 1 |
| On-Chip Cache | — | 32 KB |
| Core Voltage | — | 1.45 V to 1.6 V |
| I/O Voltage | — | 3.3 V |
| Process Technology | — | HiPerMOS7, 0.13 micron |
| Encapsulado | — | 516-PBGA (27 x 27 mm) |
| Temperatura de funcionamiento | — | 0 C to 105 C |
| Integrated Peripherals | — | PCI, USB, HDLC, 10/100 Ethernet |
| Communications Module | — | CPM with multi-channel HDLC and ATM |
| PCI Interface | — | PCI 2.2 compliant |
| USB Interface | — | USB 1.1 (function or host with external PHY) |
| Ethernet MACs | — | Up to 3 x 10/100 Ethernet |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |