MPC8260ACZUMHBB vs XPC8260VVIFBC Comparación
Comparación detallada lado a lado de MPC8260ACZUMHBB por NXP Semiconductors y XPC8260VVIFBC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8260ACZUMHBB - PowerQUICC II MPU 266MHz TBGA-480 | NXP
MPC8260ACZUMHBB ✗ Fin de vida
Comparación de especificaciones
| Parámetro | MPC8260ACZUMHBB | XPC8260VVIFBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $162,10 | $140,00 |
| Manufacturer | NXP Semiconductors (originally Motorola / Freescale) | NXP Semiconductors |
| Series | PowerQUICC II (MPC82xx) | — |
| Family | MPC8260A HiP4 Family (Hardware Specifications) | — |
| Core | PowerPC G2 | — |
| Architecture | RISC, 32-bit | — |
| Number of Cores | 1 | — |
| Core Frequency | 266 MHz | — |
| Ancho del bus de datos | 64-bit | — |
| Process Technology | 0.25 micrometer CMOS (HiP4) | 0.29 µm CMOS |
| Supply Voltage (Core) | 1.8 V | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage range] | — |
| Package Type | T-BGA (TBGA-480) | — |
| Package Dimensions | 37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch | — |
| Número de pines | 480 | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Integrated Ethernet | 10/100 Ethernet MAC | — |
| UTOPIA Interface | UTOPIA II | — |
| HDLC Channels | 256 channels | — |
| Hardware Floating Point | Yes (per family overview) | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Part Family | — | PowerQUICC II (MPC82xx) |
| Core Architecture | — | PowerPC G2 (603e-derived), 32-bit RISC |
| Core Count | — | 1 |
| Maximum Core Clock | — | 200 MHz |
| Tensión de alimentación | — | 3.3 V |
| Communications Processor Module | — | PowerQUICC II CPM (dual 10/100 Ethernet, ATM, HDLC/PDMA) |
| External Data Bus | — | 64-bit |
| External Address Bus | — | 32-bit |
| Encapsulado | — | 480-TBGA (37.5 x 37.5 mm) |
| Temperature Grade | — | Commercial |