MPC8260ACZUMHBB vs XPC8260VVIFBC Vergleich

Detaillierter Direktvergleich von MPC8260ACZUMHBB von NXP Semiconductors und XPC8260VVIFBC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8260ACZUMHBB MPC8260ACZUMHBB - PowerQUICC II MPU 266MHz TBGA-480 | NXP

MPC8260ACZUMHBB - PowerQUICC II MPU 266MHz TBGA-480 | NXP

MPC8260ACZUMHBB ✗ Abgekündigt
NXP Semiconductors
XPC8260VVIFBC XPC8260VVIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP

XPC8260VVIFBC - PowerPC G2 MPU 200MHz 480-TBGA | NXP

XPC8260VVIFBC Obsolete

Spezifikationsvergleich

Parameter MPC8260ACZUMHBB XPC8260VVIFBC
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $162,10 $140,00
Manufacturer NXP Semiconductors (originally Motorola / Freescale) NXP Semiconductors
Series PowerQUICC II (MPC82xx) —
Family MPC8260A HiP4 Family (Hardware Specifications) —
Core PowerPC G2 —
Architecture RISC, 32-bit —
Number of Cores 1 —
Core Frequency 266 MHz —
Datenbusbreite 64-bit —
Process Technology 0.25 micrometer CMOS (HiP4) 0.29 µm CMOS
Supply Voltage (Core) 1.8 V —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage range] —
Package Type T-BGA (TBGA-480) —
Package Dimensions 37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch —
Anzahl der Pins 480 —
Montageart Surface Mount Surface Mount (BGA)
Integrated Ethernet 10/100 Ethernet MAC —
UTOPIA Interface UTOPIA II —
HDLC Channels 256 channels —
Hardware Floating Point Yes (per family overview) —
Betriebstemperatur [DATA_NEEDED: operating temperature range] —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
RoHS-Status [DATA_NEEDED: RoHS compliance] Compliant
Lead-Free [DATA_NEEDED: lead-free status] Yes
Part Family — PowerQUICC II (MPC82xx)
Core Architecture — PowerPC G2 (603e-derived), 32-bit RISC
Core Count — 1
Maximum Core Clock — 200 MHz
Versorgungsspannung — 3.3 V
Communications Processor Module — PowerQUICC II CPM (dual 10/100 Ethernet, ATM, HDLC/PDMA)
External Data Bus — 64-bit
External Address Bus — 32-bit
Gehäuse — 480-TBGA (37.5 x 37.5 mm)
Temperature Grade — Commercial

Datenblätter & Ressourcen

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