MPC8270VVUPEA vs MPC8265AVVPIBC Comparación
Comparación detallada lado a lado de MPC8270VVUPEA por NXP Semiconductors y MPC8265AVVPIBC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8270VVUPEA - PowerQUICC II 450MHz MPU | NXP Semiconductors
MPC8270VVUPEA ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC8270VVUPEA | MPC8265AVVPIBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $145,00 | $167,59 |
| Core Architecture | PowerPC G2_LE | — |
| Core Count | 1 | — |
| Ancho del bus de datos | 32 bit | — |
| Frecuencia de reloj máxima | 450 MHz | — |
| Performance | 885 MIPS | — |
| Instruction Cache | 16 KB L1 | — |
| Data Cache | 16 KB L1 | — |
| Ethernet | Dual 10/100 Mbps MAC | 10/100 Mbps (2x MAC) |
| PCI Interface | PCI 2.2, 32-bit, up to 66 MHz | — |
| USB | USB 1.1 host/slave | No |
| Serial Protocols | HDLC, UART, SPI, I2C | — |
| Encapsulado | 480-TBGA (37.5 x 37.5 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0C to +105C | -40C to +85C (industrial) |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Family | PowerQUICC II MPC82xx | — |
| System Bus | 60x-compatible | — |
| Process Technology | 0.13 um HiP7 | 0.25 um CMOS |
| Manufacturer | — | NXP USA Inc. |
| Series | — | MPC82xx |
| Core Processor | — | PowerPC G2 |
| Number of Cores | — | 1 |
| Bus Width | — | 32-Bit |
| Speed (Clock) | — | 300 MHz |
| Co-Processors / DSP | — | Communications; RISC CPM |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | No |
| SATA | — | No |
| PCI | — | Yes (PCI bridge) |
| Operating Voltage | — | 3.3 V (core/IO); 2.0 V internal |
| Encapsulado / Carcasa | — | 480-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Part Status | — | Not For New Designs (NRND) |