MPC8270VVUPEA vs MPC8265AVVPIBC Comparaison
Comparaison détaillée côte à côte de MPC8270VVUPEA par NXP Semiconductors et MPC8265AVVPIBC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8270VVUPEA - PowerQUICC II 450MHz MPU | NXP Semiconductors
MPC8270VVUPEA ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC8270VVUPEA | MPC8265AVVPIBC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $145,00 | $167,59 |
| Core Architecture | PowerPC G2_LE | — |
| Core Count | 1 | — |
| Largeur du bus de données | 32 bit | — |
| Fréquence d'horloge maximale | 450 MHz | — |
| Performance | 885 MIPS | — |
| Instruction Cache | 16 KB L1 | — |
| Data Cache | 16 KB L1 | — |
| Ethernet | Dual 10/100 Mbps MAC | 10/100 Mbps (2x MAC) |
| PCI Interface | PCI 2.2, 32-bit, up to 66 MHz | — |
| USB | USB 1.1 host/slave | No |
| Serial Protocols | HDLC, UART, SPI, I2C | — |
| Boîtier | 480-TBGA (37.5 x 37.5 mm) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Température de fonctionnement | 0C to +105C | -40C to +85C (industrial) |
| Statut RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Family | PowerQUICC II MPC82xx | — |
| System Bus | 60x-compatible | — |
| Process Technology | 0.13 um HiP7 | 0.25 um CMOS |
| Manufacturer | — | NXP USA Inc. |
| Series | — | MPC82xx |
| Core Processor | — | PowerPC G2 |
| Number of Cores | — | 1 |
| Bus Width | — | 32-Bit |
| Speed (Clock) | — | 300 MHz |
| Co-Processors / DSP | — | Communications; RISC CPM |
| RAM Controllers | — | DRAM, SDRAM |
| Graphics Acceleration | — | No |
| Display & Interface Controllers | — | No |
| SATA | — | No |
| PCI | — | Yes (PCI bridge) |
| Operating Voltage | — | 3.3 V (core/IO); 2.0 V internal |
| Boîtier / Format | — | 480-TBGA (37.5 x 37.5 mm) |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| Part Status | — | Not For New Designs (NRND) |