MPC8308CVMAGD vs MPC8378ECVRANGA Comparación
Comparación detallada lado a lado de MPC8308CVMAGD por NXP Semiconductors y MPC8378ECVRANGA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8378ECVRANGA - PowerQUICC II Pro SoC, 800MHz | NXP
MPC8378ECVRANGA ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC8308CVMAGD | MPC8378ECVRANGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,90 | $65,40 |
| Core Architecture | PowerPC e300c3 | Power Architecture e300c4s |
| Number of Cores | 1 | — |
| Ancho del bus de datos | 32-bit | 32-Bit |
| Maximum CPU Clock | 400 MHz | — |
| Operating Temperature (TJ) | -40C to +105C | — |
| Package Type | MAPBGA-473 (19x19 mm, 0.8mm pitch) | — |
| Recuento de pines | 473 | — |
| Lead Free | Yes | — |
| Tipo de montaje | Surface Mount | — |
| Process Technology | 90 nm CMOS | — |
| Core Supply Voltage (Vdd) | 1.0 V (typical) | — |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Memory Controller | 16-bit DDR2 (up to 256 MB addressable) | DDR1/DDR2 up to 400 MHz |
| Ethernet Interfaces | 1x RGMII + 1x SGMII (10/100/1000 Mbps) | — |
| USB Controller | USB 2.0 Full-Speed Host/Device | — |
| PCI Express | 1x PCIe Endpoint | 2 x PCI Express lanes |
| Security Engine | DES/3DES/AES/SHA-1/MD5/RNG | SEC 4.4 (IPsec/SSL) |
| Lifecycle Stage | ACTIVE | — |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Core Frequency | — | 800 MHz |
| Supply Voltage Core | — | 1.8 V |
| Supply Voltage DDR I/O | — | 2.5 V |
| Supply Voltage I/O | — | 3.3 V |
| Ethernet | — | 4 x 10/100/1000 Mbps |
| PCI | — | 2 x PCI |
| USB | — | 2 x USB 2.0 with PHY |
| SATA | — | 2 x SATA II |
| Encapsulado | — | 689-TEBGA II (31x31 mm, 1 mm pitch) |
| Temperatura de funcionamiento | — | -40C to +105C |
| Manufacturing Process | — | 0.09 µm CMOS |