MPC8321EVRADDC vs MPC8321CVRADDC Comparación
Comparación detallada lado a lado de MPC8321EVRADDC por NXP Semiconductors y MPC8321CVRADDC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8321EVRADDC - PowerQUICC II Pro 266MHz e300c2 SoC | NXP
MPC8321EVRADDC ✓ ActivoNXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ ActivoComparación de especificaciones
| Parámetro | MPC8321EVRADDC | MPC8321CVRADDC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $38,40 | $20,75 |
| Architecture | PowerPC e300c2 (RISC) | — |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-bit | — |
| Maximum Clock Speed | 266 MHz | — |
| Package Type | PBGA-516 (27x27 mm, 2.25 mm height) | 516-ball TEBGA (Plastic Ball Grid Array) |
| Package Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Supply Voltage (Core) | 1.0 V typical | — |
| Memory Interface | DDR1 / DDR2 | — |
| Peripheral Interfaces | PCI, USB 2.0, QUICC Engine (QE), SEC engine | — |
| Security Engine | Integrated (DES/3DES/AES/SHA) | — |
| Ethernet Support | Multi-PHY via QUICC Engine | — |
| Temperatura de funcionamiento | 0C to +105C | — |
| Lead-Free | Yes (per datasheet) | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Family | PowerQUICC II Pro / MPC8323E family | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xxx / MPC83xx |
| Core | — | PowerPC e300c2 |
| Core Architecture | — | 32-bit Power Architecture |
| Core Clock Speed | — | 266 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 90 nm CMOS |
| Tensión de alimentación | — | 1.8 V / 2.5 V / 3.3 V |
| Package Dimensions | — | 27 mm x 27 mm |
| Rango de temperatura de funcionamiento | — | -40C to +105C |
| Integrated Memory Controller | — | DDR1 / DDR2 SDRAM |
| Integrated Peripherals | — | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC |
| Encryption / SEC Block | — | Not included (non-E variant) |