MPC8323ECVRADDC vs MPC8323CVRADDC Comparación
Comparación detallada lado a lado de MPC8323ECVRADDC por NXP Semiconductors y MPC8323CVRADDC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC8323ECVRADDC | MPC8323CVRADDC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $62,40 | $26,40 |
| Part Status | Active | — |
| Core Processor | PowerPC e300c2 | — |
| Number of Cores / Bus Width | 1 Core, 32-Bit | — |
| Core Speed | 266 MHz | — |
| Series | MPC83xx | — |
| Family | PowerQUICC II Pro | — |
| Security Engine (SEC) | Yes (SEC 2.0) | — |
| USB | USB 2.0 (Host/Device/OTG) | USB 2.0 (Full/High Speed) |
| PCI | 2x PCI 2.3 | PCI 2.3 |
| Memory Controller | DDR/DDR2 with ECC | DDR1/DDR2 SDRAM |
| UTOPIA Interface | UTOPIA-L2 (ATM/PHY) | — |
| Ethernet | 2x 10/100 Mbps FCC | 2x 10/100/1000 Mbps MAC (GMII/RGMII/RTBI) |
| Temperatura de funcionamiento | -40C to +105C | -40C to +105C |
| Encapsulado | 516-PBGA, 27x27 mm | 516-PBGA (27x27 mm) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Core Architecture | — | PowerPC e300c2 |
| Core Frequency | — | 266 MHz |
| Core Count | — | 1 |
| Bit Width | — | 32-bit |
| Instruction Cache | — | 16 KB |
| Data Cache | — | 16 KB |
| Communications Engine | — | QUICC Engine (QE) |
| Core Voltage | — | 1.0 V |
| DDR I/O Voltage | — | 1.8 V / 2.5 V |
| I/O Voltage | — | 3.3 V |
| Process Technology | — | 90 nm CMOS |
| Lead Free Status | — | Lead Free |