MPC8360VVAGDGA vs MPC8360EVVAGDGA Comparación
Comparación detallada lado a lado de MPC8360VVAGDGA por NXP Semiconductors y MPC8360EVVAGDGA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Última compraComparación de especificaciones
| Parámetro | MPC8360VVAGDGA | MPC8360EVVAGDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Última compra |
| Core Architecture | PowerPC e300 (Power Architecture technology) | — |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | 1 |
| Ancho del bus de datos | 32-bit | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) | PowerQUICC II Pro (MPC8360E family) |
| Core Supply Voltage (Vcore) | 1.2 V | — |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V | — |
| Rango de temperatura de funcionamiento | 0C to +105C | 0C to +105C (TA) |
| Encapsulado | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) | 740-TBGA (37.5 x 37.5 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (TBGA ball grid) |
| Memory Interface | DDR1 / DDR2 memory controller | — |
| PCI Interface | 32-bit PCI v2.3 | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| USB | 1 x USB 2.0 (host/device) | USB 2.0 |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) | — |
| Serial Interfaces | UART, I2C, SPI, TDM | — |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Frecuencia de reloj máxima | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Memory Controller | — | DDR1/DDR2 SDRAM with ECC |
| Security Engine | — | SEC (IPSEC/SSL/SRNG) |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Estado RoHS | — | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |