MPC8360VVAGDGA vs MPC8360EVVAGDGA Comparaison
Comparaison détaillée côte à côte de MPC8360VVAGDGA par NXP Semiconductors et MPC8360EVVAGDGA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC8360VVAGDGA | MPC8360EVVAGDGA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Dernier achat |
| Core Architecture | PowerPC e300 (Power Architecture technology) | — |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | 1 |
| Largeur du bus de données | 32-bit | 32-bit |
| Series | MPC83xx (PowerQUICC II Pro) | PowerQUICC II Pro (MPC8360E family) |
| Core Supply Voltage (Vcore) | 1.2 V | — |
| I/O Supply Voltage | 1.8 / 2.5 / 3.3 V | — |
| Plage de température de fonctionnement | 0C to +105C | 0C to +105C (TA) |
| Boîtier | 740-TBGA (37.5 x 37.5 mm, 1 mm pitch) | 740-TBGA (37.5 x 37.5 mm) |
| Type de montage | Surface Mount | Surface Mount (TBGA ball grid) |
| Memory Interface | DDR1 / DDR2 memory controller | — |
| PCI Interface | 32-bit PCI v2.3 | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | 1 x 10/100/1000 Mbps MAC (RGMII) | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| USB | 1 x USB 2.0 (host/device) | USB 2.0 |
| Communications Engine | QUICC Engine (HDLC / ATM / TDM) | — |
| Serial Interfaces | UART, I2C, SPI, TDM | — |
| Lead Free / RoHS | No-Pb (non-ENC, NO-PB variant per Mouser listing) | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Fréquence d'horloge maximale | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Memory Controller | — | DDR1/DDR2 SDRAM with ECC |
| Security Engine | — | SEC (IPSEC/SSL/SRNG) |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Statut RoHS | — | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |