MPC8360ZUAGDGA vs MPC8360ZUAJDGA Comparación
Comparación detallada lado a lado de MPC8360ZUAGDGA por NXP Semiconductors y MPC8360ZUAJDGA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ Última compraComparación de especificaciones
| Parámetro | MPC8360ZUAGDGA | MPC8360ZUAJDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Última compra |
| Processor Type | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) | — |
| Core Count | 1 | — |
| Architecture | 32-Bit Power Architecture | — |
| Core Clock Speed | 400 MHz | 533 MHz |
| Core Voltage | 1.2 V | — |
| Encapsulado / Carcasa | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) | — |
| Packaging | Tray | — |
| Temperatura de funcionamiento | 0 C to 105 C | 0 C to +105 C |
| Memory Interface | DDR1/DDR2 controller with ECC | — |
| Ethernet | 1 x 10/100/1000 (Gigabit Ethernet) | 10/100/1 GbE (GMII/RGMII) |
| PCI Interface | 32-bit / 66 MHz PCI | PCI 2.2 (32-bit, 66 MHz) |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 (host/device) |
| TDM / Serial | Multiple TDM channels (T1/E1/J1/HDLC/ATM) | — |
| Revision | Revision 2.x TBGA | — |
| Encryption | Non-encryption variant (no SEC 2.0) | Non-encryption (no SEC) |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Lead Free | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | PowerQUICC II Pro, MPC83xx |
| Core Processor | — | PowerPC e300 |
| Core Architecture | — | Power Architecture, 32-bit |
| Number of Cores | — | 1 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Process Technology | — | 0.13 micron CMOS |
| Encapsulado | — | 740-TBGA (37.5 x 37.5 mm) |
| Tipo de montaje | — | Surface Mount (T-BGA) |
| Memory Controller | — | DDR1 / DDR2 with ECC |
| Serial Interfaces | — | TDM, ATM, HDLC (QUICC Engine) |
| Supply Voltage Rails | — | 1.8 V / 2.5 V / 3.3 V |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |