MPC8360ZUAGDGA vs MPC8360ZUAJDGA Comparaison
Comparaison détaillée côte à côte de MPC8360ZUAGDGA par NXP Semiconductors et MPC8360ZUAJDGA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC8360ZUAGDGA | MPC8360ZUAJDGA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Dernier achat |
| Processor Type | PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) | — |
| Core Count | 1 | — |
| Architecture | 32-Bit Power Architecture | — |
| Core Clock Speed | 400 MHz | 533 MHz |
| Core Voltage | 1.2 V | — |
| Boîtier / Format | 740-LBGA / 740-TBGA (37.5 x 37.5 mm) | — |
| Packaging | Tray | — |
| Température de fonctionnement | 0 C to 105 C | 0 C to +105 C |
| Memory Interface | DDR1/DDR2 controller with ECC | — |
| Ethernet | 1 x 10/100/1000 (Gigabit Ethernet) | 10/100/1 GbE (GMII/RGMII) |
| PCI Interface | 32-bit / 66 MHz PCI | PCI 2.2 (32-bit, 66 MHz) |
| USB Interface | USB 2.0 Full-Speed | USB 2.0 (host/device) |
| TDM / Serial | Multiple TDM channels (T1/E1/J1/HDLC/ATM) | — |
| Revision | Revision 2.x TBGA | — |
| Encryption | Non-encryption variant (no SEC 2.0) | Non-encryption (no SEC) |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead Free Status | Lead Free | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Series | — | PowerQUICC II Pro, MPC83xx |
| Core Processor | — | PowerPC e300 |
| Core Architecture | — | Power Architecture, 32-bit |
| Number of Cores | — | 1 |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Process Technology | — | 0.13 micron CMOS |
| Boîtier | — | 740-TBGA (37.5 x 37.5 mm) |
| Type de montage | — | Surface Mount (T-BGA) |
| Memory Controller | — | DDR1 / DDR2 with ECC |
| Serial Interfaces | — | TDM, ATM, HDLC (QUICC Engine) |
| Supply Voltage Rails | — | 1.8 V / 2.5 V / 3.3 V |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |