MPC855TZQ50D4 vs MPC855TVR66D4 Comparación
Comparación detallada lado a lado de MPC855TZQ50D4 por NXP Semiconductors y MPC855TVR66D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC855TVR66D4 - 66MHz PowerQUICC MPC8xx MPU 357-BGA | NXP
MPC855TVR66D4 ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC855TZQ50D4 | MPC855TVR66D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,50 | $55,40 |
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | 32-bit Power Architecture | — |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 | — |
| Communications Processor Module (CPM) | Yes (RISC-based offload engine) | — |
| Ethernet Support | 10/100 Mbps Fast Ethernet MAC | Fast Ethernet (100 Mbps) |
| ATM Support | Yes (ATM SAR) | — |
| HDLC/SDLC Support | Yes | — |
| PCMCIA Interface | Yes | — |
| Instruction Cache | 4 KB | — |
| Data Cache | 4 KB | — |
| MMU | Yes | — |
| Encapsulado | 357-ball PBGA (25 x 25 mm) | 357-PBGA (25x25 mm) |
| Temperatura de funcionamiento | 0C to +95C | 0 °C to +95 °C |
| Process Technology | 0.32 um CMOS (per FindIC reference data) | 0.32 µm |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Tensión de alimentación | [DATA_NEEDED: core/IO voltage values] | — |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (single core) |
| Ancho del bus de datos | — | 32 bit |
| Frecuencia de reloj máxima | — | 66 MHz |
| Communication Interfaces | — | ENET, ATM, HDLC, PCMCIA |
| Communication Processor Module | — | Yes (CPM, dedicated RISC engine) |
| Categoría | — | Microprocessors (MPU) |
| Tray Packaging | — | Tray |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |