MPC859PZP133A vs MPC866PZP133A Comparación
Comparación detallada lado a lado de MPC859PZP133A por NXP Semiconductors y MPC866PZP133A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC859PZP133A - 133MHz PowerQUICC MPU 357-BGA | NXP Semiconductors
MPC859PZP133A ObsoleteNXP Semiconductors
MPC866PZP133A - PowerQUICC 32-Bit MPU 133MHz | NXP 357-BGA
MPC866PZP133A ⚠ Última compraComparación de especificaciones
| Parámetro | MPC859PZP133A | MPC866PZP133A |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $55,40 | $51,90 |
| Processor Series | MPC8xx (PowerQUICC) | — |
| Core | Power Architecture 32-bit | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-bit | — |
| Core Frequency | 133 MHz | 133 MHz |
| Co-Processor | Communications Processor Module (CPM) | — |
| RAM Controllers | DRAM | — |
| Ethernet | 10 Mbps (1 port), 10/100 (1 port) | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Core Voltage | 1.8 V | — |
| I/O Voltage | 3.3 V | — |
| Temperatura de funcionamiento | 0 C to +95 C | 0 C to +95 C |
| Encapsulado / Carcasa | 357-PBGA (25x25 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead (some date codes) | — |
| Estado RoHS | Non-Compliant (contains lead) | — |
| Part Lifecycle | Obsolete | — |
| Series | — | PowerQUICC I (MPC866) |
| Core Architecture | — | MPC8xx (Power Architecture) |
| Core Bit Width | — | 32-bit |
| External Bus Frequency | — | 66 MHz |
| Process Technology | — | 0.18 micron |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V (5 V TTL tolerant) |
| Encapsulado | — | 357-PBGA (Plastic Ball Grid Array) 25x25 mm |
| Communication Features | — | 10/100 Ethernet MAC, HDLC/SDLC, UART, SPI, I2C |
| Compliance | — | RoHS status depends on variant (verify with NXP PCN) |
| Lifecycle | — | End-of-Life / Last-Time-Buy (per NXP product discontinuance notice) |