MPC859PZP133A vs MPC866PZP133A Comparaison
Comparaison détaillée côte à côte de MPC859PZP133A par NXP Semiconductors et MPC866PZP133A par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC859PZP133A - 133MHz PowerQUICC MPU 357-BGA | NXP Semiconductors
MPC859PZP133A ObsoleteNXP Semiconductors
MPC866PZP133A - PowerQUICC 32-Bit MPU 133MHz | NXP 357-BGA
MPC866PZP133A ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC859PZP133A | MPC866PZP133A |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $55,40 | $51,90 |
| Processor Series | MPC8xx (PowerQUICC) | — |
| Core | Power Architecture 32-bit | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-bit | — |
| Core Frequency | 133 MHz | 133 MHz |
| Co-Processor | Communications Processor Module (CPM) | — |
| RAM Controllers | DRAM | — |
| Ethernet | 10 Mbps (1 port), 10/100 (1 port) | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Core Voltage | 1.8 V | — |
| I/O Voltage | 3.3 V | — |
| Température de fonctionnement | 0 C to +95 C | 0 C to +95 C |
| Boîtier / Format | 357-PBGA (25x25 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead (some date codes) | — |
| Statut RoHS | Non-Compliant (contains lead) | — |
| Part Lifecycle | Obsolete | — |
| Series | — | PowerQUICC I (MPC866) |
| Core Architecture | — | MPC8xx (Power Architecture) |
| Core Bit Width | — | 32-bit |
| External Bus Frequency | — | 66 MHz |
| Process Technology | — | 0.18 micron |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V (5 V TTL tolerant) |
| Boîtier | — | 357-PBGA (Plastic Ball Grid Array) 25x25 mm |
| Communication Features | — | 10/100 Ethernet MAC, HDLC/SDLC, UART, SPI, I2C |
| Compliance | — | RoHS status depends on variant (verify with NXP PCN) |
| Lifecycle | — | End-of-Life / Last-Time-Buy (per NXP product discontinuance notice) |