MPC859TZP133A vs MPC859TVR133A Comparación

Comparación detallada lado a lado de MPC859TZP133A por NXP Semiconductors y MPC859TVR133A por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPC859TZP133A MPC859TZP133A - PowerQUICC 133MHz MPU 32-Bit | NXP | 357-BGA

MPC859TZP133A - PowerQUICC 133MHz MPU 32-Bit | NXP | 357-BGA

MPC859TZP133A Nrnd
NXP Semiconductors
MPC859TVR133A MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A ✗ Fin de vida

Comparación de especificaciones

Parámetro MPC859TZP133A MPC859TVR133A
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida NRND Fin de vida
Estado del stock In Stock In Stock
Precio unitario (USD) $41,20 $54,10
Processor Type MPC8xx PowerQUICC 32-Bit MPU —
Core Architecture PowerPC Power Architecture, 32-Bit RISC Power Architecture (32-bit)
Operating Frequency 133 MHz —
Core Process Technology 0.18 um CMOS —
Core Voltage 1.8 V —
I/O Voltage 3.3 V —
Number of Cores 1 1
Encapsulado / Carcasa 357-BBGA (PBGA 25x25 mm) —
Tipo de montaje Surface Mount Surface Mount (BGA)
Temperatura de funcionamiento 0C to +95C 0C to +95C (commercial/industrial grade)
Lead Free Status Contains Lead (per DigiChip listing) —
Estado RoHS Non-Compliant (per DigiChip listing, datasheet legacy) See manufacturer PCN (legacy status)
Packaging Tray —
Peripheral Highlights CPM (Communications Processor Module), SCCs, FCCs, PCI interface, memory controller —
Series / Family MPC859T - Quad Integrated Communications Controller (PowerQUICC I) —
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Series — PowerQUICC, MPC8xx family
Core / Series Name — MPC8xx
Frecuencia de reloj máxima — 133 MHz
Ancho del bus de datos — 32 bit
Package Type — 357-PBGA (Plastic Ball Grid Array)
Package Dimensions — 25 x 25 mm
On-Chip Cache — 8 KB instruction / 8 KB data (per datasheet family)
Communication Channels — 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration)
Peripheral Interfaces — SPI, I2C, PCMCIA, IDMA, UART
Lifecycle — End-of-Life per NXP product page

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