MPC860TCZQ50D4 vs MPC855TCZQ50D4 Comparación
Comparación detallada lado a lado de MPC860TCZQ50D4 por NXP Semiconductors y MPC855TCZQ50D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
MPC860TCZQ50D4 ✗ Fin de vidaNXP Semiconductors
MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
MPC855TCZQ50D4 ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC860TCZQ50D4 | MPC855TCZQ50D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,80 | $22,10 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale / Motorola) |
| Part Number | MPC860TCZQ50D4 | — |
| Family | PowerQUICC / MPC8xx | — |
| Core | MPC8xx - 1 core, 32-bit | — |
| Core Architecture | PowerPC | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Clock Speed | 50 MHz | 50 MHz |
| Instruction / Data Cache | 4 KB / 4 KB (unified 8KB figure variant-dependent) | — |
| Tensión de alimentación de funcionamiento | 2 V to 3.6 V (per FindIC comparison page) | — |
| Encapsulado | 357-PBGA (25x25 mm), ZQ suffix | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +95C (industrial) | -40C to +95C |
| Estado RoHS | Non-Compliant (per NXP product page / DigiChip datasheet) | Non-Compliant (legacy BGA contains lead) |
| Lead-Free | Contains lead (ZQ denotes tin-lead ball finish) | — |
| CPM (Communications Processor Module) | Integrated - HDLC, UART, Ethernet 10 Mbps support | — |
| DMA Channels | 4 | — |
| Memory Controller | Up to 256 MB DRAM with page mode support | — |
| Process Technology | 0.32 um CMOS (per FindIC description) | 0.32 um CMOS |
| Estado del ciclo de vida | End of Life (NXP Last Time Buy window passed) | — |
| Product Type | — | Microprocessor (MPU) |
| Processor Family | — | PowerQUICC MPC8xx / PowerPC |
| Number of Cores | — | 1 |
| Ancho del bus de datos | — | 32-bit |
| Tensión de alimentación | — | 3.3 V |
| Encapsulado / Carcasa | — | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| Integrated Peripherals | — | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| On-chip Memory Controller | — | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | — | Tray |
| Lead Free Status | — | Contains Lead |