MPC860TCZQ50D4 - 50MHz PowerQUICC MPU, 357-PBGA | NXP
N.º de pieza: MPC860TCZQ50D4 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $27.5 | $27,50 |
| 10 | $24.85 | $248,50 |
| 100 | $21.4 | $2.140,00 |
| 500 | $18.95 | $9.475,00 |
| 1.000 | $16.8 | $16.800,00 |
MPC860TCZQ50D4 Descripción general
An MPU (Microprocessor Unit) is an integrated processor device built around a CPU core, on-chip memory controllers and peripheral interfaces, sitting one tier above a microcontroller and one tier below an SoC in the embedded computing hierarchy. The MPC860TCZQ50D4 belongs to NXP's MPC8xx PowerQUICC family - a widely deployed communications-oriented processor family that combines general-purpose control processing with dedicated serial-channel hardware for protocol termination.
Key features of the MPC860TCZQ50D4 include integrated 4-channel DMA, 8KB instruction/data cache, memory controller with DRAM support up to 256 MB, and the embedded CPM block supporting HDLC/SDLC, UART, BISYNC, and Ethernet (10 Mbps) protocol termination. The 357-pin BGA package provides the I/O density required for the 32-bit address/data bus and the multiple serial-channel pins.
Architecturally, the device separates control-plane work (PowerPC core) from data-plane communication work (CPM), enabling concurrent protocol handling without burdening the main CPU. The CPM uses microcoded RISC engines (CP) and serial-interface controllers (SCC/SMC) to offload framing, CRC, and HDLC bit-stuffing tasks from the host CPU, reducing interrupt load in router/bridge/DSLAM designs.
Typical applications include WAN routers, ISDN/ADSL modems, Ethernet bridges, industrial control and HMI controllers, and legacy telecom line cards. The PowerQUICC family is well documented in NXP/Freescale reference designs and the Green Hills INTEGRITY, VxWorks, and Linux (pre-2020 LTS) BSP ecosystems.
When designing with this part, note that the device is now End-of-Life per NXP, with last-time-buy window passed. New designs should consider the PowerQUICC II (MPC82xx) or QorIQ families for forward compatibility, while existing hardware can be maintained with the part itself or with verified stock held by franchise distributors.
This page aggregates distributor pricing (DigiKey 2026-10-16), drop-in alternative families from the MPC8xx product line, and practical design notes not consolidated in the original PowerQUICC hardware specifications manual.
Alternativas directas para MPC860TCZQ50D4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC860TCZQ50D4 (mismo factor de forma y huella) — difiere en Core Architecture, Memory Controller, Package, RoHS Status, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC860SRCZQ50D4
✅ Sustitución directa✓ En stock
$64.5 / unidad
Ver hoja de datos →MPC860SRZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860TVR50D4
✅ Sustitución directa✓ En stock
$58 / unidad
Ver hoja de datos →MPC855TVR50D4
✅ Sustitución directa✓ En stock
$48.1 / unidad
Ver hoja de datos →MPC860DTCZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860TCZQ50D4 Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC860TCZQ50D4 |
| Family | PowerQUICC / MPC8xx |
| Core | MPC8xx - 1 core, 32-bit |
| Core Architecture | PowerPC |
| Core Clock Speed | 50 MHz |
| Instruction / Data Cache | 4 KB / 4 KB (unified 8KB figure variant-dependent) |
| Tensión de alimentación de funcionamiento | 2 V to 3.6 V (per FindIC comparison page) |
| Encapsulado | 357-PBGA (25x25 mm), ZQ suffix |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +95C (industrial) |
| Estado RoHS | Non-Compliant (per NXP product page / DigiChip datasheet) |
| Lead-Free | Contains lead (ZQ denotes tin-lead ball finish) |
| CPM (Communications Processor Module) | Integrated - HDLC, UART, Ethernet 10 Mbps support |
| DMA Channels | 4 |
| Memory Controller | Up to 256 MB DRAM with page mode support |
| Process Technology | 0.32 um CMOS (per FindIC description) |
| Estado del ciclo de vida | End of Life (NXP Last Time Buy window passed) |
Configuración de pines de MPC860TCZQ50D4
| Pin A1 | VDD — Core supply (3.3V typical) |
| Pin A20 | GND — Ground |
| Pin B1 | IRQ0 — External interrupt request 0 |
| Pin AB1 | TCLK — Test clock |
| Pin AB20 | RESET — Reset input (open-drain) |
| Pin C5 | TXD1 — SCC1 transmit data (CPM) |
| Pin D4 | RXD2 — SCC2 receive data (CPM) |
| Pin E10 | D0 — Data bus bit 0 |
| Pin E11 | D1 — Data bus bit 1 |
| Pin F1 | A0 — Address bus bit 0 |
| Pin G20 | WE — Memory write enable |
| Pin H2 | RAS — DRAM row address strobe |
| Pin J18 | CAS — DRAM column address strobe |
| Pin K1 | BDIP — Bus busy data input/parity |
| Pin L20 | DP0 — DMA channel 0 request |
| Pin M5 | SMI — SPI mode input (CPM) |
| Pin N16 | VP — Versatile pin (special function) |
| Pin P3 | ENET_TXD — Ethernet transmit (CPM FEC/eCPM) |
| Pin R12 | ENET_RXD — Ethernet receive (CPM FEC) |
| Pin T7 | TRQ1 — Serial interrupt request 1 |
Aplicaciones típicas
MPC860TCZQ50D4 es adecuado para 6 aplicacións: WAN Router Control Plane, ISDN / ADSL Modem Bridge, Legacy Industrial HMI Controller, Embedded Telecom Line Card, Networking Switch Management CPU, Ruggedized Printer / Imaging Controller.
WAN Router Control Plane
The NXP MPC860TCZQ50D4 fits WAN router control-plane applications because its integrated Communications Processor Module (CPM) handles HDLC, UART and Ethernet at 10 Mbps without burdening the PowerPC core with bit-level protocol work. The 50 MHz core clock provides adequate performance for routing-table management, SNMP polling, and CLI servicing. Compared to a discrete multi-chip design, the MPC860TCZQ50D4 cuts BOM by combining the CPU, memory controller (up to 256 MB DRAM) and serial-channel controllers in a single 357-PBGA package. EOL status means it is best for maintaining deployed router hardware rather than new product introductions.
Recomendado
ISDN / ADSL Modem Bridge
The MPC860TCZQ50D4 integrates the multi-channel DMA and SCC/SMC serial controllers that ISDN/ADSL modem bridges require for U-layer framing and link-management packet handling. Its 8KB instruction/data cache serves the small real-time control loops typical of modem firmware, while the CPM off-loads CRC and HDLC bit-stuffing tasks from the host CPU at line rate. The 3.3 V supply voltage aligns with the typical DSL modem transformer-driver rail. Place a 50 MHz MPC860TCZQ50D4 between the AFE and the host Ethernet MAC to terminate xDSL link-layer framing transparently.
Recomendado
Legacy Industrial HMI Controller
The MPC860TCZQ50D4 at 50 MHz has sufficient headroom for industrial HMI (Human-Machine Interface) controllers that drive modest-resolution LCD panels and aggregate fieldbus inputs through the integrated SCC ports. Its 4-channel DMA moves display frame-buffer data without CPU intervention, and the 357-PBGA package provides ample pin count for parallel LCD data buses plus UART links to external PLCs. Industrial-grade operating temperature (-40C to +95C) makes it suitable for factory-floor enclosures. Long product-lifecycle support makes EOL parts like this particularly amenable to legacy maintenance rather than new design wins.
Recomendado
Embedded Telecom Line Card
For E1/T1 line-card applications the MPC860TCZQ50D4 provides multi-channel HDLC termination through its SCC ports, supporting up to four full-duplex HDLC channels at T1/E1 rates. The integrated memory controller handles the per-channel descriptor DMA buffers in DRAM, reducing external glue logic. Pair the part with a single Ethernet PHY for backhaul aggregation, leveraging the integrated Ethernet block. The 357-BGA package is well suited to densely populated line cards where multiple BGA parts share the same PCB - the 25x25 mm body keeps the package compact.
Recomendado
Networking Switch Management CPU
The MPC860TCZQ50D4 suits layer-2 switch management-CPU use because the PowerPC core can run the management firmware stack (CLI, SNMP, RSTP) while the CPM handles ancillary serial-channel links for stacking cables or out-of-band management. The 50 MHz clock is comfortably above the floor for management-plane workloads. With 8 KB cache the part may offload routing-protocol forwarding to dedicated switch ASICs while managing health-monitoring and configuration. Most switch designs pair the MPC860TCZQ50D4 with an external Ethernet PHY rather than using the integrated Ethernet.
Recomendado
Ruggedized Printer / Imaging Controller
The MPC860TCZQ50D4 acts as the central controller in high-throughput industrial printers and imaging systems. Its 32-bit PowerPC core runs the page-description-language interpreter, while the SCC ports drive motor controllers and the integrated DMA feeds the print-head data path without CPU saturation. The 357-BGA package's high I/O count supports multiple dedicated UARTs for ink-jet driver boards plus a parallel interface to the imaging sensor. Industrial-temperature operation matches commercial printing/labeling environments, and the EOL lifecycle status aligns with the long-term service support typical of industrial-printing equipment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC860TCZQ50D4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC860SRCZQ50D4 | MPC860SRZQ50D4 | MPC860TVR50D4 | MPC855TVR50D4 | MPC860DTCZQ50D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-BGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Core Clock Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Operating Voltage | 2 V - 3.6 V (3.3 V nominal) | 2 V - 3.6 V | 2 V - 3.6 V | 2 V - 3.6 V | 2 V - 3.6 V | 2 V - 3.6 V |
| Cache Size | 8 KB unified | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPM (Comm Processor Module) | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated (with crypto) |
| Operating Temperature | -40C to +95C (industrial) | Extended grade | Standard grade | -40C to +95C | Industrial grade | Extended (DT suffix) |
| RoHS Compliance | Non-Compliant (ZQ = Pb balls) | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Lifecycle Status | EOL (NXP) | EOL | EOL | EOL | EOL | EOL |
Diferenciadores clave
- Integrated CPM reduces BOM for multi-channel serial applications (frente a Discrete CPU plus external HDLC controllers)
- 50 MHz PowerPC core with on-chip 8KB cache (frente a Older 68k-based Motorola MC68360)
- Wide 32-bit data bus and large DRAM controller (frente a 16-bit bus MPU alternatives in same BGA-357 footprint)
Notas de diseño
Decouple the 357-BGA's VDD and GND balls with low-ESR ceramic capacitors placed as close as possible to each ball group. The MPC860TCZQ50D4 typically draws 1-2 W of core power at 50 MHz; budget for bulk decoupling on the 3.3 V rail with at least one 100 uF tantalum and 10 x 0.1 uF ceramic decoupling caps distributed across the BGA. Power sequencing is critical - apply VDD before driving the PORESET pin high, otherwise the CPM may enter an indeterminate state.
Estimated: at 1.5 W typical power dissipation in a 357-PBGA package with theta_JA around 20 C/W (4-layer PCB, no airflow), junction temperature rise is approximately 30 C above ambient. For enclosed industrial enclosures at +70 C ambient, junction remains within the 125 C maximum. For sealed fanless designs or higher ambient, add copper heatsink thermal pads or thermal vias beneath the package center ball matrix for additional thermal dissipation margin.
The 357-BGA pitch is 1.27 mm requiring via-in-pad or dog-bone escape routing in the PCB. Use 4+ layer stackup with continuous ground plane beneath the BGA, plus power islands on layer 2 and 4 for VDD. Match trace lengths within +/- 0.5 inches (12 mm) on the address and data bus. BGA reballing requires a stencil designed for the 1.27 mm pitch - use 0.5 mm aperture openings with 0.1 mm thickness stainless steel.
Place external SDRAM/DRAM chips with matched-length address and control traces (RAS, CAS, WE) routed together to avoid skew. The MPC860's memory controller generates the bus clock - route it on the inner PCB layer with controlled impedance 50 ohm +-10% to the SDRAM clock pin. Avoid running the bus clock adjacent to high-noise CPM serial lines - cross perpendicular or use ground pins to separate them.
EOL caveat: do not design new platforms around the MPC860TCZQ50D4. NXP has formally discontinued the part, and active firmware development (new Linux BSP versions) ended years ago. Existing designs should maintain a 12-24 month safety stock inventory of MPC860TCZQ50D4 units, with planning to migrate to PowerQUICC II (MPC8250/MPC8260) or QorIQ (P1020/T1024) when possible. Beware of counterfeit stock - buy from authorized NXP distributors only (DigiKey, Avnet, Rochester Electronics, Arrow), not from independent brokers.
Información de cumplimiento
Non-RoHS due to ZQ tin-lead ball finish per DigiChip datasheet summary. Reach-compliant per NXP product page standard disclosure. Not AEC-Q100 qualified (consumer/industrial networking target). Not lead-free; halogen-free status not explicitly stated in provided web data.
