MPC860TVR50D4 vs MPC860TCVR50D4 Comparación
Comparación detallada lado a lado de MPC860TVR50D4 por NXP Semiconductors y MPC860TCVR50D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC860TVR50D4 | MPC860TCVR50D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,00 | $0,00 |
| Core Architecture | PowerPC 32-bit | — |
| Core Count | 1 | 1 core |
| Frecuencia de reloj máxima | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Encapsulado / Carcasa | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | 0.32 micrometer |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | — |
| Rango de temperatura de funcionamiento | -40°C to +95°C | — |
| Tipo de montaje | Surface Mount (BGA) | Surface mount |
| Series | MPC8xx PowerQUICC | — |
| Estado RoHS | [DATA_NEEDED: rohs compliance] | RoHS compliant |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Processor Type | — | MPC8xx PowerQUICC 32-bit microprocessor |
| Processor Architecture | — | RISC, 32-bit |
| Operating Speed | — | 50 MHz |
| Tensión de alimentación | — | 3.3 V |
| Encapsulado | — | 357-pin PBGA, 25 x 25 mm |
| Package Type | — | 357-BBGA |
| Packaging | — | Tray |
| Lead-Free Status | — | Lead free |
| Application Category | — | Communications and networking controllers |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Memory Configuration | — | [DATA_NEEDED: internal and external memory configuration] |
| I/O Interfaces | — | [DATA_NEEDED: communications and peripheral interfaces] |
| Power Consumption | — | [DATA_NEEDED: power consumption conditions] |
| Clocking and Reset | — | [DATA_NEEDED: clock and reset requirements] |
| Pinout | — | [DATA_NEEDED: complete 357-ball assignment] |